April 7 - 11, 2025
Seattle, Washington
Symposium Supporters
2025 MRS Spring Meeting & Exhibit
EL16.01.02

A Self-Expanding and Degradable Biomaterial Enabling Self-Flattening Film-Based Devices for Catheter Delivery

When and Where

Apr 8, 2025
11:00am - 11:15am
Summit, Level 4, Room 437

Presenter(s)

Co-Author(s)

Ruoxing Wang1,Xudong Wang1

University of Wisconsin-Madison1

Abstract

Ruoxing Wang1,Xudong Wang1

University of Wisconsin-Madison1
The post-implantation shape recovery can enable the catheter delivery of large area thin-film based bioelectronics. To be safely triggered and applying sufficient force during flattening process, we developed a water-absorbable chitosan composite that provides long-lasting interchain repulsive forces when exposed to body fluids through synergistic effects of hydrogen bonding, plasticization, and nanoscale distance confining. The water-modulated modulus and significant volume expansion were balanced to achieve the stable and strong tensile force for self-flattening process of thin film-based structures. The chitosan-based composite was biocompatible, biodegradable, and hemocompatible, proving its biosafety of implantations. The in vivo flattening capability was demonstrated using a rolled triboelectric nanogenerator (TENG) in intracardiac implantation. After a 20-min flattening period, morphological changes were clearly observed by X-ray. Additionally, the self-powered TENG, driven by heartbeats, exhibited significantly enhanced electrical performance comparable to commercial ECG signals. This minimally invasive implantation of flexible film-based devices represents an essential step toward the eventual development of advanced implantable bioelectronics. This novel coating material is expected to have immediate impacts on the catheter implantation of various other flexible, thin film-based biomedical devices, such as health monitoring sensors, drug delivery systems, and electrical stimulation electrodes.

Keywords

biomaterial | strength

Symposium Organizers

Xudong Wang, University of Wisconsin--Madison
Miso Kim, Sungkyunkwan University
Wenzhuo Wu, Purdue University
Till Fromling, Technical University of Darmstadt

Symposium Support

Bronze
APL Electronic Devices

Session Chairs

Xudong Wang
Wenzhuo Wu

In this Session