Development of high thermal conductive composites using epoxy/hBN via magnetic alignment approach

With the rapid development in the electronics industry, heat accumulation and uneven temperature distribution have become critical issues, often leading to the thermal failure of devices. To address these challenges, polymer-based composites with enhanced thermal conductivity and high dielectric properties are gaining significant attention. In this study, a representative volume element (RVE) approach was employed to predict the elastic modulus, thermal conductivity, and coefficient of thermal expansion of polymer composites using 3D finite element (FE) simulations. Periodic boundary conditions (PBC) were applied to ensure accurate prediction of the composite's macroscopic properties. The RVE model captured the influence of filler-matrix interactions and particle alignment on thermal performance. The predicted thermal conductivity and coefficient of thermal expansion closely matched experimental results from various composite systems reported in the literature, including those using epoxy as a matrix reinforced with hBN, graphene, Al₂O₃, and AlN fillers. To further validate the RVE modeling, hBN/epoxy composites will be fabricated and systematically investigated for their thermal properties. The hBN particles will be functionalized via a chemical route to improve compatibility with the epoxy matrix. The composite fabrication process involved compression molding, followed by drying in a vacuum oven at 70°C for 6 hours. A magnetic field will be applied during the curing process to achieve directional alignment of the hBN particles, further enhancing the thermal conductivity. Experimental results show a significant improvement in the thermal conductivity and stability of the composites, validating the accuracy of the RVE predictions. These findings demonstrate that hBN/epoxy composites are promising candidates for efficient heat dissipation in high-performance electronic devices.