High-Speed, Pinhole-Free, Uniform Wet Deposition Techniques for Two-Dimensional Materials

For the practical application of 2D materials, it is essential to develop inexpensive, high-speed deposition techniques that offer uniformity, scalability, broad applicability, and adjustable thickness. In this work, rapid drying is highlighted as a key mechanism behind two innovative wet deposition methods: hot dipping and air knife sweeping (AKS). These methods enable precise thickness control based on flake concentration, ensuring tiled monolayers and pinhole-free coverage across the substrate, as long as the drying rate exceeds flake diffusion. AKS further improves uniformity by preventing edge defects caused by contact line pinning. With a deposition speed of 0.21 m²/min, AKS far outperforms traditional techniques, allowing for large substrate applications over 1 m². Additionally, these methods offer advantages such as low debonding force in flexible display production and short-circuit prevention in nanometer-thin capacitors, which exhibit charge storage and leakage current performance comparable to commercial multilayer ceramic capacitors (MLCCs). Overall, these new approaches provide efficient and scalable solutions for manufacturing nanodevices based on 2D materials.