April 7 - 11, 2025
Seattle, Washington
Symposium Supporters
2025 MRS Spring Meeting & Exhibit
SF01.09.02

A Thermal Boundary Resistance model via mean free path suppression functions and a Gibbs excess approach

When and Where

Apr 9, 2025
5:00pm - 7:00pm
Summit, Level 2, Flex Hall C

Presenter(s)

Co-Author(s)

Eleonora Isotta1,Ryohei Nagahiro2,Alesanmi Odufisan1,Junichiro Shiomi2,Oluwaseyi Balogun1,Jeff Snyder1

Northwestern University1,The University of Tokyo2

Abstract

Eleonora Isotta1,Ryohei Nagahiro2,Alesanmi Odufisan1,Junichiro Shiomi2,Oluwaseyi Balogun1,Jeff Snyder1

Northwestern University1,The University of Tokyo2
The impact of interfaces and grain boundaries on heat transport is often quantified in terms of thermal boundary resistance. Numerous models have been proposed over the years to describe this resistance. Recent experimental results in thermal conductivity imaging have highlighted the possibility of a local suppression in conductivity around material grain boundaries. In this work, we propose a semi-empirical model to predict the thermal conductivity profile as a function of distance to a boundary, to help explain experimental observations. The model is based on a geometrical suppression in the phonon mean free path and accounts for phonon transmission at the boundary. Calculated excess thermal boundary resistances, extracted from spatially dependent thermal conductivities with a Gibbs excess approach, are well-matched with predictions from the Landauer formalism when considering heat flow normal to the boundary. This agreement holds for different material systems and over temperature. The excess thermal resistance is thus expected to represent well the theoretical boundary resistance. The understanding provided in this work can aid the interpretation of thermal conductivity images across interfaces. The development of models that account for the impact of specific defects on heat transport can significantly advance the design of materials and devices for applications in energy, heat management and electronics.

Keywords

grain boundaries | interface | thermal conductivity

Symposium Organizers

Yee Kan Koh, National University of Singapore
Zhiting Tian, Cornell University
Tianli Feng, University of Utah
Hyejin Jang, Seoul National University

Session Chairs

Tianli Feng
Yee Kan Koh

In this Session