Anisotropic Thermal Conductivity for High Performance Deformable Electronics

Owing to the growing demand for highly integrated electronics, anisotropic heat dissipation of thermal management material is a challenging and promising technique. Moreover, maintaining high thermal conductivity during the deformation of electronic materials is at issue to satisfy the needs for advancing flexible and stretchable electronic devices. Thus, we would like present here is an effective assembly technique to enhance verical and lateral directional thermal conduction with effectively assembled boron nitride (BN) nanomaterials, creating 3D thermal paths for anisotropic dissipation integrated with deformable electronics. The structured BN layer in the composites induces a high thermal conductivity over 5 W m⁻¹ K⁻¹ in the through-plane and 10 W m⁻¹ K⁻¹ in the in-plane direction at the limited BN fraction. Furthermore, this structured BN composite maintains high deformability for the stretchable and flexible electronics. Various electronic device demonstrations provide exceptional heat dissipation capabilities, including thin film silicon transistor and light-emitting diode on flexible and stretchable composite, respectively.