Fabrication of Hybrid Particles with Dual-Functionality for EMI Shielding and Heat Dissipation

Semiconductor packaging technology and industry are developing toward higher performance, higher integration, thinner thickness, and miniaturization. Consequently, there is a problem in that the amount of heat generated from the device increases and electromagnetic interference (EMI) occurs inside the PIM semiconductor. Therefore, packaging requires both high heat dissipation and EMI shielding performance.
In this study, an insulating and heat dissipating thin film was deposited on the surface of the magnetic particles. The deposited thin film composition was analyzed through elemental analysis. The insulating properties of the fabricated particle were measured and it was confirmed that the resistance increased. Heat dissipation properties and EMI shielding properties of the fabricated particles were measured by manufacturing composite film. Our results achieved 13% increased thermal conductivity properties compared to films manufactured using pristine particles. EMI shielding characteristics were measured in the Ka band (26.5-30 GHz), and reflection and absorption performance were calculated and analyzed.