April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)
Symposium Supporters
2024 MRS Spring Meeting
MF01.09.01

3D Printed Stretchable Soft Electronics with Metamaterials-Inspired Electromagnetic Architecture

When and Where

Apr 24, 2024
8:30am - 8:45am
Room 325, Level 3, Summit

Presenter(s)

Co-Author(s)

LeiBin Li1,Dwipak Sahu1,Jared Anklam1,Samuel Hales1,Samannoy Ghosh1,Yong Lin Kong1

University of Utah1

Abstract

LeiBin Li1,Dwipak Sahu1,Jared Anklam1,Samuel Hales1,Samannoy Ghosh1,Yong Lin Kong1

University of Utah1
The integration of electronics with soft and stretchable materials can enable active functionalities on the otherwise passive constructs. Previous works have demonstrated exciting success in imparting stretchability with geometrical designs but often require challenging microfabrication processes. Here, we propose a 3D printing approach that can create freeform electronics by selectively annealing micro-extruded nanomaterials <i>in situ </i>using a metamaterials-inspired electromagnetic architecture. This enables the creation of microscale three-dimensional interconnects and electronics with a desktop-sized platform that can resist strain and flexing – allowing the integration of stretchable active components on a soft substrate. We are also studying the integration of printed electronics into a broad range of soft materials by leveraging soft matter physics phenomena. Overall, we envision that this approach can enable new fabrication methodologies that lead to strategies that not only improve device compatibility and durability but also enable new classes of 3D-printed soft electronics.

Keywords

3D printing | additive manufacturing

Symposium Organizers

Emily Davidson, Princeton University
Michinao Hashimoto, Singapore University of Technology and Design
Emily Pentzer, Texas A&M University
Daryl Yee, École Polytechnique Fédérale de Lausanne

Symposium Support

Silver
UpNano US Inc.

Session Chairs

Emily Pentzer
Daryl Yee

In this Session