Apr 24, 2024
8:30am - 8:45am
Room 325, Level 3, Summit
LeiBin Li1,Dwipak Sahu1,Jared Anklam1,Samuel Hales1,Samannoy Ghosh1,Yong Lin Kong1
University of Utah1
LeiBin Li1,Dwipak Sahu1,Jared Anklam1,Samuel Hales1,Samannoy Ghosh1,Yong Lin Kong1
University of Utah1
The integration of electronics with soft and stretchable materials can enable active functionalities on the otherwise passive constructs. Previous works have demonstrated exciting success in imparting stretchability with geometrical designs but often require challenging microfabrication processes. Here, we propose a 3D printing approach that can create freeform electronics by selectively annealing micro-extruded nanomaterials <i>in situ </i>using a metamaterials-inspired electromagnetic architecture. This enables the creation of microscale three-dimensional interconnects and electronics with a desktop-sized platform that can resist strain and flexing – allowing the integration of stretchable active components on a soft substrate. We are also studying the integration of printed electronics into a broad range of soft materials by leveraging soft matter physics phenomena. Overall, we envision that this approach can enable new fabrication methodologies that lead to strategies that not only improve device compatibility and durability but also enable new classes of 3D-printed soft electronics.