April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)

Event Supporters

2024 MRS Spring Meeting
EN07.19.08

Strain-Driven Anomalous Lattice Thermal Conductivity in BaPdS2

When and Where

May 7, 2024
9:50am - 9:55am
EN07-virtual

Presenter(s)

Co-Author(s)

Xiao Yu1,2,Can Wu1,Jia Hong2,Bo Xu1

Yanshan University1,Beijing Institute of Technology2

Abstract

Xiao Yu1,2,Can Wu1,Jia Hong2,Bo Xu1

Yanshan University1,Beijing Institute of Technology2
Strain engineering is one of the most promising and effective routes toward continuously turning the electronic and optical properties of materials, while thermal property is generally believed to be sensitive and positive with the mechanical compress strain. In this paper, we investigated the lattice thermal conductivity of zigzag chain-like wrinkled structure BaPdS<sub>2</sub> with uniaxial compress strain along <i>c</i>-axis based on first-principles calculations and phonon Boltzmann transport equation. Unlike the commonly belief that the lattice thermal conductivity increases (or decrease) with compress (or tensile) strain for bulk materials, it is found that the <i>κ<sub>latt</sub></i>-<i>c</i> was nearly unchanged and <i>κ<sub>latt</sub></i>-<i>a</i> was increased exceptionally for BaPdS<sub>2</sub> with strain imposed in <i>c</i>-axis. The unusual strain dependence thermal conductivity in <i>c</i>-axis was mainly attributed to the enhanced phonon phase space that neutralized the weakened anharmonicity and the enhanced group velocity. While the abnormal increased <i>κ<sub>latt</sub></i>-<i>a</i> is attributed to the weak anharmonicity with compress strain perpendicular to <i>a</i>-axis, equivalent to uniform biaxial tension strain in <i>ab</i> plane. In addition, high thermal conductivity anisotropy was observed because of the large group velocity disparity along <i>a</i>- and <i>c</i>-axis. The finding discovers materials with unusual thermal conduction mechanism under strain along different directions, as well as provides new material platforms for potential heat-routing or heat-managing devices.

Keywords

thermal conductivity

Symposium Organizers

Woochul Kim, Yonsei University
Sheng Shen, Carnegie Mellon University
Sunmi Shin, National University of Singapore
Sebastian Volz, The University of Tokyo

Session Chairs

Shuang Cui
Sunmi Shin

In this Session