Apr 25, 2024
11:00am - 11:15am
Room 433, Level 4, Summit
Samannoy Ghosh1,Jared Anklam1,Kyle Harshany1,Breanna Wong1,Sammi Yu1,Eric Tokita1,Samuel Hales1,Aarav Parikh1,Yong Lin Kong1
University of Utah1
Samannoy Ghosh1,Jared Anklam1,Kyle Harshany1,Breanna Wong1,Sammi Yu1,Eric Tokita1,Samuel Hales1,Aarav Parikh1,Yong Lin Kong1
University of Utah1
The ability for bioelectronics to be resorbed to the body can obviate the need for surgical extraction, reducing potential complications and clinical burden in bioelectronics implantation. Advances in bioresorbable electronics have enabled a broad range of transient electronics, yet achieving three-dimensional integration with bioresorbable electronics remains a challenging goal. Microextrusion-based 3D printing can create freeform wireless electronics that can be directly integrated with a broad range of three-dimensional biomedical devices and biological constructs. Nevertheless, formulating a 3D printing ink that simultaneously possesses the rheological properties and electronics properties necessary for high-performance wireless electronics has not been demonstrated. Here, we developed a 3D printable ink that is bioresorbable and electrical conductive ink. Our ink demonstrates excellent electrical conductivity (3 x 10<sup>4</sup> S/m) and possesses rheological properties that allow the preservation of geometrical fidelity. We envision that our work can enable the direct integration of transient bioelectronics into a broad range of biomedical devices and biological constructs, improving the potential clinical outcome in 3D-printed bioelectronics.