April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)
Symposium Supporters
2024 MRS Spring Meeting
SB06.03.21

3D Printing Conductive Hydrogels with Tunable Properties for Soft Robotics and Biosensing

When and Where

Apr 23, 2024
5:00pm - 7:00pm
Flex Hall C, Level 2, Summit

Presenter(s)

Co-Author(s)

Trevor Kalkus1,Tamara Unterreiner1,Laura Wächter1,Christina Schmitt1,Christine Selhuber-Unkel1

Heidelberg University1

Abstract

Trevor Kalkus1,Tamara Unterreiner1,Laura Wächter1,Christina Schmitt1,Christine Selhuber-Unkel1

Heidelberg University1
Soft electronics can serve a central role in the development of biosensors, wearable devices, and soft electronics. For these applications, flexible circuits with complex and organic geometries will be necessary. The 3D printing of conductive hydrogels offers a simple manufacturing method for creating such structures and provides opportunities for rapid iteration and modification. Because different applications may call for various hydrogel properties, we demonstrate the ability to tune ink viscosity, hydrogel stiffness, and hydrogel conductivity. These functional hydrogels are based on acrylamide, due its stability and ubiquity, and PEDOT:PSS, a commonly used conductive organic polymer, is embedded to provide conductivity. With thorough characterization, we highlight the advantages of designing conductive hydrogels in this way. Ultimately, we demonstrate the ability to print the components suitable for soft electronics. While this work provides a preliminary demonstration, future steps will focus on applying this method to create biosensors and soft robotics.

Symposium Organizers

Neel Joshi, Northeastern University
Eleni Stavrinidou, Linköping University
Bozhi Tian, University of Chicago
Claudia Tortiglione, Istituto di Scienze Applicate e Sistemi Intelligenti

Symposium Support

Bronze
Cell Press

Session Chairs

Eleni Stavrinidou
Claudia Tortiglione

In this Session