April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)
Symposium Supporters
2024 MRS Spring Meeting & Exhibit
SB04.11.31

Accessing New Optoelectronic Devices and Architectures through The Solid-Phase Processing of Conjugated Polymers

When and Where

Apr 25, 2024
5:00pm - 7:00pm
Flex Hall C, Level 2, Summit

Presenter(s)

Co-Author(s)

Guillermo Esparza1,Darren Lipomi1,David Fenning1

University of California, San Diego1

Abstract

Guillermo Esparza1,Darren Lipomi1,David Fenning1

University of California, San Diego1
Optoelectronic materials and devices are ubiquitous in the modern world. Thin-film processing of these materials is essential in a tremendous range of applications such as consumer electronics, healthcare, defense, scientific instrumentation, and renewable power generation and storage, to name a few. Among optoelectronic materials, conjugated polymers are of significant technological interest and are typically processed from either the vapor, liquid, or solution phases. Unfortunately, all of these techniques come with various downsides and limitations. Processing restrictions (such as solvent orthogonality) or device architectures (such as tectured surfaces) impose potential processing incompatabilities and therefore limits on the devices which may be realized. For this reason, exploring novel processing routes is pivotal to unlocking the full potential any material.<br/><br/>Processing and application of thin films directly from the solid phase (that is, the creation of standalone thin films which are subsequently transferred onto a substrate or undergo other processing) has not been well expored, but has the potential of addressing various pitfalls that arise in conventional processing methods. This talk will be focus several techniques in this category, which have utilized pre-formed thin-films to form coatings on non-planar surfaces, coat sensitive substrates without exposure to heat or liquid solvents, as well as serve as a sacrificial vehicle in order to premptively deposit materials which would otherwise damage the rest of a device stack. Special emphasis will be given to how these approaches can outperform conventional processing methods as well as how they can be leveraged to enable devices which may have been previously impossible to realize.

Keywords

additive manufacturing | self-assembly | solvent casting

Symposium Organizers

Paddy K. L. Chan, University of Hong Kong
Katelyn Goetz, National Institute of Standards and Technology
Ulrike Kraft, Max Planck Institute for Polymer Research
Simon Rondeau-Gagne, University of Windsor

Symposium Support

Bronze
Journal of Materials Chemistry C
Proto Manufacturing

Session Chairs

Paddy K. L. Chan
Katelyn Goetz
Ulrike Kraft
Simon Rondeau-Gagne

In this Session