April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)

Event Supporters

2024 MRS Spring Meeting
EN08.12.01

Room Temperature Minimum Thermal Conductivity in 3D Weak Topological Insulators

When and Where

Apr 26, 2024
8:30am - 9:00am
Room 336, Level 3, Summit

Presenter(s)

Co-Author(s)

Jihui Yang1

University of Washington1

Abstract

Jihui Yang1

University of Washington1
In contrast to the conventional belief that the consideration for topological insulators (TIs) as potential thermoelectrics is due to their excellent electrical properties benefiting from the topological surface states, our work shows that the 3D weak TIs, formed by alternating stacks of quantum spin Hall layers and normal insulator (NI) layers, can also be decent thermoelectrics because of their thermal transport. We found that the 3D weak TI Bi<sub>14</sub>Rh<sub>3</sub>I<sub>9</sub> possesses the minimum thermal conductivity at room temperature, very unusual for a crystalline material. Our work revealed that the topologically “trivial” NI layers play a surprisingly critical role in hindering phonon propagation. The weak bonding in the NI layers gives rise to significantly low sound velocity, and the localized low-frequency vibrations of the NI layers cause strong acoustic–optical interactions and lattice anharmonicity. All these features are favorable for the realization of exceptionally low lattice thermal conductivity, and therefore present remarkable opportunities for developing high-performance thermoelectrics in weak TIs.

Keywords

thermoelectricity

Symposium Organizers

Ernst Bauer, Vienna Univ of Technology
Jan-Willem Bos, University of St. Andrews
Marisol Martin-Gonzalez, Inst de Micro y Nanotecnologia
Alexandra Zevalkink, Michigan State University

Session Chairs

Ernst Bauer
Kornelius Nielsch

In this Session