April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)
Symposium Supporters
2024 MRS Spring Meeting & Exhibit
EN02.05.10

Metallic Glass Thin Film Electrodes for Chemically and Mechanically Stable Interface for Flexible Electronics

When and Where

Apr 24, 2024
5:00pm - 7:00pm
Flex Hall C, Level 2, Summit

Presenter(s)

Co-Author(s)

Jae Sang Cho1,Woongsik Jang1,Keum Hwan Park2,Dong Hwan Wang1

Chung-Ang University1,Korea Electronics Technology Institute2

Abstract

Jae Sang Cho1,Woongsik Jang1,Keum Hwan Park2,Dong Hwan Wang1

Chung-Ang University1,Korea Electronics Technology Institute2
Metallic glasses (MGs) or amorphous alloys gained attentions for their attractive mechanical properties and chemical stabilities, which originate from the randomly oriented atomic arrangement in the MGs that results in their strong strain-resistance and chemical inertness. MGs are often characterized by the absence of grain boundaries, which are often responsible for initiating catastrophic mechanical failures and corrosion (and other chemical reactions). Recently, their applicability in thin film via physical vapor deposition method have motivated researchers to replace electrode materials to MG thin films. MG thin films exhibit varying electrical and mechanical characteristics depending on their atomic compositions, thus should be analyzed thoroughly before replacing conventional electrode materials for the electrodes. Here, we present intriguing cases of adopting MG thin films for electrodes of organic photovoltaic cells and sensors. Through detailed investigations on MG thin films, fabrication of thin film devices with enhanced stability and flexibility is achieved. In specific, amorphous metallic surface in contact with polymers circumvents oxidation reaction caused by ambient air, which prevents formation of insulating oxides and loss of electrical conductivity of the electrode itself. In addition, MG thin film exhibited high crack resilience in bendable and stretchable devices, which yielded flexible devices with high flexibility and reliability.<br/> <br/>Reference (1) <i>Organic Electronics</i> 84 (2020): 105811.<br/>Reference (2) <i>Electrochimica Acta</i> 446 (2023): 142053.<br/>Reference (3) <i>Journal of Alloys and Compounds</i> 944 (2023) 169219.

Keywords

metal

Symposium Organizers

Jinbo Bai, CNRS ECParis
Daniel Hallinan, Florida State University
Chang Kyu Jeong, Jeonbuk National University
Andris Sutka, Riga Technical University

Session Chairs

Chang Kyu Jeong
Kwi-Il Park

In this Session