April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)

Event Supporters

2024 MRS Spring Meeting
EL03.09.05

A Novel Approach for High Precision Printing of Micro-Bumps

When and Where

Apr 25, 2024
9:45am - 10:00am
Room 346, Level 3, Summit

Presenter(s)

Co-Author(s)

Anthony Fiorini1,Marc Pascual1,Achille Guitton1,Amin M'barki1

Hummink1

Abstract

Anthony Fiorini1,Marc Pascual1,Achille Guitton1,Amin M'barki1

Hummink1
High aspect ratio micro-bumps play a critical role in flip chip applications, facilitating enhanced pixel density and reduced pixel-to-pixel coupling noise. The necessity for micro-bumps with a diameter of less than 5 um, featuring these high aspect ratios, underscores the limitation of conventional technologies. This study discussed how HPCAP (High Precision Capillary Printing) Technology, allows the one-step fabrication of such micro-bumps. HPCAP capitalizes on capillary forces and resonance as intrinsic drivers, preventing the requirement for external energy sources. Inspired by Atomic Force Microscopy (AFM), this technique achieves remarkable precision, with up to 5 nm accuracy along the Z-axis and 20 nm along the XY axes. This level of precision ensures impeccable control over the dimensions and shapes of the micro-bumps enabling exceptional versatility in design, dimensions, and choice of materials.

Keywords

Ag | atom probe microscopy | microscale

Symposium Organizers

Serena Iacovo, imec
Vincent Jousseaume, CEA, LETI
Sean King, Intel Corp
Eiichi Kondoh, University of Yamanashi

Symposium Support

Silver
Tokyo Electron Limited

Bronze
Air Liquide
CEA- Leti

Session Chairs

Silvia Armini
Eiichi Kondoh

In this Session