Development of Conductive Metal Layers-Integrated 3D-Printed Polymers Driven by Thiol-Mediated Electroless Plating Process

Metalizing three-dimensional (3D)-printed polymers has attracted significant attention for the fabrication of high-end, customized electrical components. In this study, we introduce a simple yet highly effective method for integrating conductive metal layers onto 3D-printed polymers. A photocurable 3D printing resin was specifically designed to introduce thiol groups onto the surface of the 3D-printed structures. These thiol groups served as active sites for metal ion complexation via strong metal–sulfur bonds, enabling the deposition of metal layers through an electroless plating process. This approach facilitated the uniform and robust adhesion of various metal layers, including copper (Cu) and silver (Ag), on arbitrary 3D-printed structures, demonstrating its compatibility with a range of metals. To demonstrate the potential of this method, we fabricated a Cu-layered 3D-printed electrode and successfully employed it as a functional electrochemical sensor. This strategy provides valuable insights for designing functional metallic structures and paves the way for manufacturing lightweight, customizable electrical components.