December 1 - 6, 2024
Boston, Massachusetts

Event Supporters

2024 MRS Fall Meeting & Exhibit
SF02.02.01

Strength, Ductility and Toughness in bcc vs. fcc High-Entropy Alloys

When and Where

Dec 2, 2024
1:30pm - 2:00pm
Hynes, Level 2, Room 208

Presenter(s)

Co-Author(s)

Robert Ritchie1,Punit Kumar1,David Cook1,Madelyn Payne1,Wenqing Wang1,Pedro Borges1,Andrew Minor1,Mark Asta1

University of California, Berkeley1

Abstract

Robert Ritchie1,Punit Kumar1,David Cook1,Madelyn Payne1,Wenqing Wang1,Pedro Borges1,Andrew Minor1,Mark Asta1

University of California, Berkeley1
Face-centered cubic (<i>fcc</i>) medium- and high-entropy alloys (HEAs) can display exceptional combinations of strength, tensile ductility and fracture toughness, properties that can be further enhanced at cryogenic temperatures. Body-centered cubic (<i>bcc</i>) refractory RHEAs, conversely, can display exceptional strength and compressive ductility at elevated temperatures, but are often compromised by poor lower-temperature behavior. We examine here the strength, ductility and toughness of these two classes of multiple principal-element alloys, and show that whereas some of the <i>fcc</i> HEAs exhibit among highest toughness values on record, even under extreme conditions of ultrahigh strain rates and liquid-helium temperatures, the <i>bcc</i> HEAs can display extremely low toughness when subject to <i>tensile</i> loading. We explore the reasons for such distinct properties, and investigate why most <i>bcc</i> HEAs are markedly brittle, whereas a few, such as NbTaTiHf, can display remarkably high toughness over an extremely wide range of temperatures.

Keywords

ductility | fracture | strength

Symposium Organizers

Daniel Gianola, University of California, Santa Barbara
Jiyun Kang, Stanford University
Eun Soo Park, Seoul National University
Cem Tasan, Massachusetts Institute of Technology

Session Chairs

Nicolo Maria della Ventura
Mitra Taheri

In this Session