Thermoelectric Materials and Devices for High Power Density Coolers

Future advancements in high-power electronics demand robust thermal management methodologies. Thermoelectric coolers (TECs), which operate based on the Peltier effect, present an ideal solution to this challenge. These solid-state TECs offer a lightweight design, a high coefficient of performance (COP), high power density, increased reliability, and flexibility in mounting orientation and shape. In this talk, we will explore the design of TECs for electronics cooling through computational modeling and experimental validation.<br/>Key to optimizing TEC performance is understanding the manipulation of material parameters to influence the scattering processes within materials, thereby decoupling the transport of phonons and electrons. We propose thermoelectric materials suitable for high-power cooling applications. Additionally, critical device parameters such as device thickness, leg density, and contact resistance are analyzed to determine their impact on TEC performance. Our findings indicate that achieving high cooling power density is possible by enhancing the thermoelectric power factor and optimizing the leg height and packing density of the TECs. Furthermore, scaling TECs and reducing contact resistance have been shown to provide ultra-high cooling power density.