Enhancing Moldability and Thermal Conductivity of Epoxy by Incorporating Long Alkyl Chains into Liquid Crystal Polymer Mesogens

As electronic technology advances, the miniaturization and integration of devices are accelerating. While these changes offer numerous benefits and drive technological progress, they also present spatial limitations that can lead to thermal issues affecting device performance. Addressing these thermal challenges is crucial for future technological advancements. <div> </div> <div>This study explores the enhancement of moldability and thermal conductivity of epoxy, commonly used in the electronics industry, by adding long alkyl chains of varying lengths to the mesogen of Liquid Crystal Polymers (LCPs). The plate-like structure of the LCP mesogen's aromatic ring promotes easy stacking, and the incorporation of alkyl chains can reduce the melting and curing points compared to traditional LCPs. Consequently, this material exhibits higher thermal conductivity than conventional commercial epoxies and offers improved molding capabilities.</div> <div> </div> <div>To achieve this, a series of LCP mesogens with different lengths of alkyl chains were synthesized and integrated into a commercial epoxy resin. The thermal properties of the resulting composites were characterized using advanced thermal analysis techniques. The composites demonstrated significantly reduced melting and curing points, enhancing their processing capabilities.</div> <div> </div> <div>Based on this study, the integration of LCP mesogens with varying alkyl chain lengths into commercial epoxy resin successfully improved the thermal conductivity and moldability of the composites. The resulting materials exhibited lower melting and curing points, enhancing their processing capabilities. These advancements suggest the potential for broader applications in the electronics industry, particularly in addressing thermal management challenges. This discovery of a new LCP holds potential for advancements in electronic technology and other industries, contributing to future technological stability and development.</div>