Dec 5, 2024
8:00pm - 10:00pm
Hynes, Level 1, Hall A
Tod Grusenmeyer1,Michael Brennan1,2,Douglas Krein1,2,Emmanuel Rowe1,3,4,Christopher McCleese1,2,Lirong Sun1,2,Kyle Berry1,Peter Stevenson1,Michael Susner1
Air Force Research Laboratory1,Azimuth Corporation2,National Research Council3,Middle Tennessee State University4
Tod Grusenmeyer1,Michael Brennan1,2,Douglas Krein1,2,Emmanuel Rowe1,3,4,Christopher McCleese1,2,Lirong Sun1,2,Kyle Berry1,Peter Stevenson1,Michael Susner1
Air Force Research Laboratory1,Azimuth Corporation2,National Research Council3,Middle Tennessee State University4
Lead halide perovskites are notorious for water-sensitivity and low hardness. Consequently, polishing CsPbBr<sub>3</sub> crystals to achieve high-quality surfaces is challenging. We present a breakthrough mechanical polishing methodology tailored to the specific needs of these soft, moisture-sensitive semiconductors. Three-dimensional optical surface profiles over ~1 mm<sup>2</sup> areas demonstrate high-quality surfaces with root-mean-square roughness values (<10 nm) that are unparalleled for melt-grown CsPbBr<sub>3</sub>. We additionally delve into the polished wafers’ fundamental optical constants and introduce an anti-reflection coating method, setting new standards for short-wave infrared transparency in CsPbBr<sub>3</sub>. These pivotal processing guidelines pave the way for advancing halide perovskite applications beyond academic curiosity.