Dec 3, 2024
2:00pm - 2:15pm
Hynes, Level 1, Room 110
Tianqing Wan1,Yiping Xiao1,Sijie Ma1,Yang Chai1
The Hong Kong Polytechnic University1
Tianqing Wan1,Yiping Xiao1,Sijie Ma1,Yang Chai1
The Hong Kong Polytechnic University1
Perovskite ferroelectrics with low coercive field and high crystal quality consume low write energy, which are promising for low-power memory and data-intensive applications. Ferroelectric field effect transistors (FeFETs) demonstrate remarkable energy efficiency due to the non-volatile retention and non-destructive read operation. However, the growth of high-quality perovskite ferroelectrics requires lattice-match substrates, high temperature, and oxygen atmosphere, which restricts their integration with semiconductor and insulator.<b> </b>Here we epitaxially deposit the BiFeO<sub>3</sub> on the sacrificial Sr<sub>3</sub>Al<sub>2</sub>O<sub>6</sub> layer, then transfer freestanding BiFeO<sub>3</sub> films and integrate with two-dimensional materials for metal-ferroelectric-metal-insulator-semiconductor (MFMIS) FeFETs. The freestanding BiFeO<sub>3</sub> films exhibit low coercive field (30 kV/cm) and low current leakage (10<sup>-6</sup> A/cm<sup>2</sup>). The van der Waals integration with two-dimensional (2D) materials realizes low interfacial trap density (<i>D</i><sub>it</sub>~10<sup>11</sup> cm<sup>-2</sup>eV<sup>-1</sup>), which contributes to efficient gate control and low write voltage. The resulting ferroelectric transistors show low write energy of 10<sup>-20</sup> J. This work establishes a promising route by integrating high-quality perovskite ferroelectrics for various high-performance electronic devices and physical science.