December 1 - 6, 2024
Boston, Massachusetts
Symposium Supporters
2024 MRS Fall Meeting & Exhibit
EL08.04.03

High Current Density Diamond Photoconductive Semiconductor Switches with a Buried, Metallic Conductive Channel

When and Where

Dec 3, 2024
9:30am - 9:45am
Sheraton, Second Floor, Back Bay A

Presenter(s)

Co-Author(s)

Zhuoran Han1,Jaekwon Lee1,Stephen Messing1,Thomas Reboli1,Andrey Mironov1,Can Bayram1

University of Illinois at Urbana-Champaign1

Abstract

Zhuoran Han1,Jaekwon Lee1,Stephen Messing1,Thomas Reboli1,Andrey Mironov1,Can Bayram1

University of Illinois at Urbana-Champaign1
Laterally configured diamond photoconductive semiconductor switches (PCSS) with a buried, metallic p+ current channel are reported. Above bandgap ( λ≤226 nm) optical triggering enables responsivity of over 130 mA/W. The use of low-impurity semi-insulating diamond as an active absorption layer enables fast rise and fall times (~2 ns) and on/off ratios greater than 10<sup>11</sup>. The PCSS excited with a laser energy of 20 nJ per pulse passes a high current density (44 A/cm) under a DC bias of 60 V, thanks to the buried metallic p+ current channel. The reported devices promise high current carrying capacity without the need for filamenting while leveraging the excellent optical, electronic, and thermal properties of diamond.<br/>In this work, diamond PCSS structures with electrode spacings of 8 μm, 50 μm, and 100 μm were fabricated. The lateral PCSS devices were based on a 500 μm thick, 4 × 4 mm<sup>2 </sup>Type IIa high-pressure, high-temperature (HPHT) diamond substrate. A 500 nm thick layer of heavily boron-doped p+ diamond with an atomic doping concentration of 5 × 10<sup>20</sup> cm<sup>-3</sup> was grown on which a 1.5 μm thick layer of unintentionally doped layer was grown using microwave plasma enhanced chemical vapor deposition (MPCVD). The p+ diamond layer has a sheet resistance of 41.4 Ω/square and serves as the low-resistivity channel between electrodes. Rectangular ohmic metal contacts composed of Ti (30 nm) / Pt (30 nm) / Au (100 nm) were deposited by e-beam evaporation, followed by thermal annealing at 450 <sup>o</sup>C in an ambient of argon gas. All three PCSS devices have the same contact width of 150 μm.<br/>Photoconductive measurements of the diamond PCSS devices were carried out using a tunable optical parametric oscillator (OPO) laser in the spectral range of 210-226 nm, with a laser pulse width of 5 ns. The laser spot size was fixed to a diameter of 2 mm using an aperture to keep the laser power density uniform, and the laser spectral width was below 0.1 nm. The optical power output was fixed to 40 μJ/pulse, which corresponds to a laser power density of 252 kW/cm<sup>2</sup> and total energy of 10 nJ, 127 nJ, and 191 nJ for the 8 μm, 50 μm 100 μm PCSS. The oscilloscope was triggered by a silicon photodiode that detected the scattered light of the laser.<br/>In conclusion, buried channel diamond PCSS devices fabricated on Type IIa diamond showed large on/off ratios, fast rise-time, and high current densities when excited with an above bandgap laser source. The PCSS devices exhibit linear current-voltage characteristics up to a DC bias of +/−60 V, implying that even higher current densities are possible before carrier velocity saturation occurs. TCAD simulation and experimental data predict that over 90% of current conduction is through the buried, metallic conductive channel. The buried channel design enables higher photocurrents during the ON-state utilizing the high conductivity p<sup>+</sup> channel, while still maintaining large OFF-state resistances. This study’s results advocate new designs for PCSS to realize higher ON-state current and efficiency.

Keywords

C

Symposium Organizers

Robert Bogdanowicz, Gdansk University of Technology
Chia-Liang Cheng, National Dong Hwa University
David Eon, Institut Neel
Shannon Nicley, Michigan State University

Symposium Support

Gold
Seki Diamond Systems

Bronze
Applied Diamond, Inc.
BlueWaveSemiconductor
Diatope GmbH
Element Six
Evolve Diamonds
Fine Abrasives Taiwan Co., LTD.
Fraunhofer USA
Great Lakes Crystal Technologies
HiQuTe Diamond
Plasmability LLC
QZabre AG
WD Advanced Materials

Session Chairs

David Eon
Hiroshi Kawarada

In this Session