December 1 - 6, 2024
Boston, Massachusetts
Symposium Supporters
2024 MRS Fall Meeting & Exhibit
EL08.12.01

New Applications of Diamond for Thermal Solutions

When and Where

Dec 4, 2024
3:30pm - 3:45pm
Sheraton, Second Floor, Back Bay A

Presenter(s)

Co-Author(s)

John Ciraldo1

WD Advanced Materials1

Abstract

John Ciraldo1

WD Advanced Materials1
It is well known that diamond exhibits extreme thermal properties that, harnessed effectively, can be used to significantly enhance electronics performance. Full diamond devices are expected to operate with superior performance with lower junction temperatures. But beyond diamond devices themselves, it is well established that diamond can be incorporated with other materials to achieve superior performance in existing technologies. A god example of this is GaN on diamond devices, that demonstrate significantly better performance than GaN on silicon, sapphire, or silicon-carbide. Another approach that has proven to be similarly beneficial is the application of diamond to top surfaces of devices, and GaN devices in particular. The latter, however, while effective, is limited somewhat in impact by challenges in deposition and device risks from high-temperature depositions.
Advancing technologies in automotive, data, computation, and power, combined with investments and support through the CHIPS act, have driven new efforts in integrating diamond into existing and nascent technologies. Through this talk, led by Chief Technology Officer John Ciraldo, WDAM will share an overview of new technologies and approaches being developed through WDAM with various collaborators in the semiconductor industry to address these problems. Novel approaches to diamond coating, including interlayers to improve thermal transport and conformality of PCD on device structures, use of diamond coating in silicon cooling systems, and substrates that use isotopic enrichment to achieve higher levels of thermal conductivity than is otherwise possible with diamond will be discussed, combined with data on film properties, lifetime wear, and thermal conductivity will be provided to justify these novel approaches. Use of diamond for both thermal transport and electrical shielding in devices, as well as approaches for integrating diamond in novel heterogenous structures will also be discussed as part of future developments.

Symposium Organizers

Robert Bogdanowicz, Gdansk University of Technology
Chia-Liang Cheng, National Dong Hwa University
David Eon, Institut Neel
Shannon Nicley, Michigan State University

Symposium Support

Gold
Seki Diamond Systems

Bronze
Applied Diamond, Inc.
BlueWaveSemiconductor
Diatope GmbH
Element Six
Evolve Diamonds
Fine Abrasives Taiwan Co., LTD.
Fraunhofer USA
Great Lakes Crystal Technologies
HiQuTe Diamond
Plasmability LLC
QZabre AG
WD Advanced Materials

Session Chairs

Robert Bogdanowicz
Travis Wade

In this Session