December 1 - 6, 2024
Boston, Massachusetts

Event Supporters

2024 MRS Fall Meeting & Exhibit
SF04.09.03

Characteristics of Atomic Layer Deposited SnO2 by Al Doping at Various Positions

When and Where

Dec 4, 2024
11:15am - 11:30am
Hynes, Level 3, Room 311

Presenter(s)

Co-Author(s)

Jangho Bae1,Taeyoon Lee1,Soohyun Yoon1,Dowwook Lee1,Heejun Yoon1,Hyeongtag Jeon1

Hanyang University1

Abstract

Jangho Bae1,Taeyoon Lee1,Soohyun Yoon1,Dowwook Lee1,Heejun Yoon1,Hyeongtag Jeon1

Hanyang University1
Tin dioxide (SnO<sub>2</sub>), which has a low melting point and wide bandgap (3.5~4.0eV), has properties suitable for applications such as transparent conductive oxide thin film transistors and active layers. However, SnO<sub>2</sub> has high conductivity and has the property of reducing the on/off current ratio, so research on lowering the off current is necessary to improve the electrical properties. In addition, the SnO<sub>2</sub> thin film contains many defects such as oxygen vacancies, making it difficult to control carriers and impurities in the thin film. The doping process using atomic layer deposition (ALD) has the advantage of reducing off-current and accurately contolling thickness. Among the dopant elements used as acceptors in SnO<sub>2</sub> thin films, aluminum (Al) has a higher oxidation potential (1.66V) than Sn (0.04V). Therefore, Al atoms react more strongly with oxygen than Sn, reducing oxygen vacancies in SnO<sub>2</sub>.<br/><br/>In this study, we examined the effect of Al dopants used as the acceptor in SnO<sub>2</sub> with various doping positions of Al<sub>2</sub>O<sub>3</sub> for lowering the oxygen vacancies and improving I<sub>on/off</sub> ratio. Al doped SnO<sub>2</sub> (SnO<sub>2</sub>:Al) thin films were deposited using thermal ALD with precursors of TDMA-Sn, TMA and O<sub>3</sub> as a reactant. Post-deposition annealing was carried out in an oxygen atmosphere to diffuse Al atoms uniformly and lowering oxygen vacancies of SnO<sub>2</sub> thin film and SnO<sub>2</sub>:Al thin films deposited with different Al<sub>2</sub>O<sub>3</sub> doping positions. The positions of Al were controlled by inserting twenty Al<sub>2</sub>O<sub>3</sub> cycle into the bottom, middle, and top positions out of 121 cycles (10nm thickness) using supercycle ALD method. X-ray photoelectron spectroscopy (XPS) was used to analyze the chemical bonding state and compositions of SnO<sub>2</sub> thin film and SnO<sub>2</sub>:Al thin film. It was confirmed that the SnO<sub>2</sub>:Al thin film contained low impurity (&lt;3%) such as carbon and nitrogen. Additionally, the oxygen vacancies within the SnO<sub>2</sub>:Al thin film reduced significantly compared to undoped SnO<sub>2</sub> thin film. Hall measurement analysis was examined to determine the electrical properties of SnO<sub>2</sub> thin film and SnO<sub>2</sub>:Al thin film. Compared to the undoped SnO<sub>2 </sub>thin film, the carrier concentration value decreased from 4.15×10<sup>22</sup> to 6.12×10<sup>16</sup>. Through this study, we examined the effects of various doping positions on Al-doped tin dioxide thin films by comparing their structural, chemical, and electrical properties.

Keywords

atomic layer deposition

Symposium Organizers

Jianlin Liu, University of California, Riverside
Farida Selim, Arizona State University
Chih-Chung Yang, National Taiwan Univ
Houlong Zhuang, Arizona State University

Session Chairs

Farida Selim
Joel Varley

In this Session