December 1 - 6, 2024
Boston, Massachusetts
Symposium Supporters
2024 MRS Fall Meeting & Exhibit
NM01.09.08

2D Materials as Versatile Coatings for Engineered Metal Powders in Additive Manufacturing Thermal Devices

When and Where

Dec 5, 2024
11:45am - 12:00pm
Hynes, Level 2, Room 200

Presenter(s)

Co-Author(s)

Apostolos Koutsioukis1,Ruan Siyuan1,Shuo Yin1,Rocco Lupoi1,Valeria Nicolosi1

Trinity College Dublin, The University of Dublin1

Abstract

Apostolos Koutsioukis1,Ruan Siyuan1,Shuo Yin1,Rocco Lupoi1,Valeria Nicolosi1

Trinity College Dublin, The University of Dublin1
The development of nanotechnology combined with additive manufacturing has significantly transformed the electronics industry. The transition from analog to digital technology through microchips in sectors such as computing, automotive, aerospace, and general electronics ‘operation has introduced a major challenge: heat dissipation. Data centres, for instance, are estimated to use 40% of their total energy to address thermal management issues. This underscores the urgent need for new functional materials with high thermal conductivity to develop effective heat dissipation devices.<br/>Traditionally, metal powders, especially copper, have been the go-to materials for this purpose due to their excellent thermal properties. Moreover, metals have been crucial to industrial innovation from the Bronze Age to modern times, serving as vital components in various industries. However, they come with drawbacks, including high cost and limited scalability.<br/>Recently, 2D materials such as graphene, hexagonal boron nitride (hBN), and MXenes have revolutionized nanotechnology due to their extremely and diverse chemical, mechanical and electrical properties inherent in their atomic- structure. Especially, graphene, hexagonal boron nitride (hBN) with their thermal properties emerged as promising alternatives in the heat dissipation field. Combining 2D materials, such as graphene and HBN with extremely thermal properties, with metal powders can significantly enhance their properties, expanding the possibilities for applications in diverse fields.<br/>However, an efficient and versatile preparation method to use 2D nanosheets to coat metal powders are still in its infancy. In this talk, we will introduce a new 3D printing toolbox that integrates 2D materials with metal powders (<b>2D</b>MMCs), aligning seamlessly with established large-scale manufacturing methods.<br/>In this talk, we will introduce a new 3D printing toolbox that integrates 2D nanosheets with metal powders based on ball milling technique, aligning seamlessly with established large-scale manufacturing methods. We will discuss our innovative approach and the characterization of these composites based on our advanced microscopy and spectroscopical studies. Our findings demonstrate the potential of these composites in addressing the thermal management challenges in electronics. We believe this new approach not only enhances the thermal properties of metal powders but also offers a scalable and cost-effective solution for next-generation electronics.

Keywords

reactive ball milling

Symposium Organizers

Sofie Cambré, University of Antwerp
Ranjit Pati, Michigan Technological University
Shunsuke Sakurai, National Institute of Advanced Industrial Science and Technology
Ming Zheng, National Institute of Standards and Technology

Session Chairs

Yutaka Ohno
Shunsuke Sakurai

In this Session

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