December 1 - 6, 2024
Boston, Massachusetts

Event Supporters

2024 MRS Fall Meeting & Exhibit
NM07.08.07

Thermally Conductive Polyelectrolyte Nanocomposite for Electrical Insulation

When and Where

Dec 5, 2024
9:45am - 10:00am
Hynes, Level 2, Room 201

Presenter(s)

Co-Author(s)

Ethan Iverson1,Hudson Legendre1,Sourav Chakravarty1,Anil Aryal1,Shiyu Zhang1,Sarah Fisher1,Danixa Rodriguez-Melendez1,Dallin Smith1,Kendra Schmieg1,Patrick Shamberger1,Dion Antao1,Jaime Grunlan1

Texas A&M University1

Abstract

Ethan Iverson1,Hudson Legendre1,Sourav Chakravarty1,Anil Aryal1,Shiyu Zhang1,Sarah Fisher1,Danixa Rodriguez-Melendez1,Dallin Smith1,Kendra Schmieg1,Patrick Shamberger1,Dion Antao1,Jaime Grunlan1

Texas A&M University1
As electric vehicles continuously advance, higher demands are put on the thermal transport and dielectric properties of dielectric materials to increase electric motor efficiency and power density. Furthermore, due to the increasingly complex winding architectures found in electric motors, traditional insulating procedures struggle to deposit conformal insulation layers. In this work, the layer-by-layer (LbL) assembly of polyethylenimine, mica clay, poly(acrylic acid), and hexagonal boron nitride is exploited to provide a thermally conductive (through-plane thermal conductivity ≈ 1.8 W×m<sup>-1</sup>×K<sup>-1</sup>) yet electrically insulating (breakdown strength ≈ 155 kV×mm<sup>-1</sup>) dielectric material. A remarkably high through-plane thermal conductivity (i.e., perpendicular to the substrate) is obtained due to mica and hexagonal boron nitride platelets stretching through multiple layers, a result of “jagged” deposition. The nanocomposite’s heat removal efficiency is demonstrated on a mock electric aircraft motor showing reduced max temperatures across the winding-heat sink interface at high power densities when compared to the state-of-the-art polyimide insulation. This is one of the first reports of a thermally conductive yet electrically insulating polyelectrolyte-based self assembled nanocomposite.

Keywords

nanostructure | thermal conductivity

Symposium Organizers

Qian Chen, University of Illinois at Urbana-Champaign
Sijie Chen, Karolinska Institutet
Bin Liu, National University of Singapore
Xin Zhang, Pacific Northwest National Laboratory

Symposium Support

Silver
ZepTools Technology Co., Ltd.

Session Chairs

Yuna Bae
Honghu Zhang
Xin Zhang

In this Session