Dec 3, 2024
11:00am - 11:30am
Hynes, Level 3, Room 311
Ray-Hua Horng1,Fu-Gow Tarntair1,Xin-Ying Tsai1
National Yang Ming Chiao Tung University1
Ray-Hua Horng1,Fu-Gow Tarntair1,Xin-Ying Tsai1
National Yang Ming Chiao Tung University1
In this study, various phosphorus-ion implantation techniques, incorporating low, medium, and high doses, were used to investigate the electrical properties of unintentionally doped β-Ga<sub>2</sub>O<sub>3 </sub>heteroepilayers, which were grown on sapphire substrates by metalorganic chemical vapor deposition.<br/>The low-dose implantation involved phosphorus ions at concentrations of 1.6×10<sup>13</sup>, 1×10<sup>12</sup> and 2.5×10<sup>12</sup> atoms/cm<sup>2</sup>, administered at implantation energies of 100, 50, and 40 keV, respectively. The medium-dose implantation utilized phosphorus ions at concentrations of 1.6×10<sup>14</sup>, 1×10<sup>13</sup> and 2.5×10<sup>13</sup> atoms/cm<sup>2</sup>, at the same implantation energies. Finally, the high-dose implantation employed phosphorus ions at concentrations of 1.6×10<sup>15</sup>, 1×10<sup>14 </sup>and 2.5×10<sup>14</sup> atoms/cm<sup>2</sup>, with implantation energies of 100, 50, and 40 keV, respectively. The implantation parameters were also simulated using the Stopping and Range of Ions in Matter software, while the actual concentration of phosphorus ions was measured via secondary ion mass spectrometry. Subsequently, Ni and Au were deposited on the annealed phosphorus-implanted β-Ga<sub>2</sub>O<sub>3</sub> epilayers, followed by rapid thermal annealing at 600°C in a nitrogen environment for one minute, for Hall measurement. The electrical properties of the phosphorus-implanted β-Ga<sub>2</sub>O<sub>3</sub> epilayers were assessed through Hall measurements. Notably, the β-Ga<sub>2</sub>O<sub>3</sub> epilayers implanted with middle and high doses displayed p-type behavior.<br/>The phosphorus-ion implanted Ga<sub>2</sub>O<sub>3</sub> was not only demonstrated to be the p-type. Special epilayer structure has also been designed to obtain the pn diode. It was the UID Ga<sub>2</sub>O<sub>3</sub> layer first, then ion implanted phosphorus into Ga<sub>2</sub>O<sub>3</sub> and thermal annealing to active phosphorus and obtain p-type Ga<sub>2</sub>O<sub>3</sub>. After, regrew the n-type Ga<sub>2</sub>O<sub>3</sub> on the p-type epilayer. Finally, the pn diode was fabricated using the mesa and electrodes deposition. Detailed processing and device performance will be discussed detail in the conference.