SHINERS, ECMS and ECSTM Study of Cu Surface Chemistry

Copper electrodeposition is a central process in the metallization of microelectronics and more recently has found application as the most effective electrocatalyst for the conversion of CO₂ to hydrocarbons. Gaining mechanistic insight into the reactivity of Cu surfaces requires <i>in situ </i>and better still <i>operando</i> measurements. Herein the utility of the combination of vibrational spectroscopy (SEIRAS, SHINERS), electrochemical mass spectrometry (EC-MS) and scanning tunneling microscopy (ECSTM) to examine the competitive and co-adsorption interactions between potential dependent halide adsorption, molecular adsorption, underpotential metal deposition and hydride formation on low index Cu single crystals surface will be detailed. Further still, the opportunity to study the impact of such interactions on metal deposition reactions will be discussed.