April 10 - 14, 2023
San Francisco, California
2023 MRS Spring Meeting
EL21.01.04
Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper
When and Where
Apr 11, 2023
11:45am - 12:00pm
11:45am - 12:00pm
Moscone West, Level 3, Room 3011
Presenter(s)
Co-Author(s)
Ching-Tzu Chen1,Christian Lavoie1,Nicholas Lanzillo1,Utkarsh Bajpai1,Oki Gunawan1,Asir Intisar Khan1,2,John Bruley1,Guy Cohen1,Vesna Stanic1,Hsin Lin3,Ion Garate4,Gengchiau Liang5,Shang-Wei Lien6,Yi-Hsin Tu5,6,Sushant Kumar7,Ravishankar Sundararaman7,Peter Kerns1,Teodor Todorov1,Nathan Marchack1,Jean Jordan-Sweet1,Cheng-Yi Huang8,Arun Bansil6,Tay-Rong Chang6
IBM T.J. Watson Research Ctr1,Stanford University2,Academia Sinica3,Université de Sherbrooke4,National University of Singapore5,National Cheng Kung University6,Rensselaer Polytechnic Institute7,Northeastern University8
Keywords
electrical properties
Symposium Organizers
Iuliana Radu, Taiwan Semiconductor Manufacturing Company Limited
Heike Riel, IBM Research GmbH
Subhash Shinde, University of Notre Dame
Hui Jae Yoo, Intel Corporation
Symposium Support
Gold
Center for Sustainable Energy (ND Energy) and Office of Research
Silver
Raith America, Inc.
Center for Sustainable Energy (ND Energy) and Office of Research
Silver
Raith America, Inc.
Session Chairs
Iuliana Radu
Subhash Shinde