Atomic Layer Deposition of Conformal Wafer-scale WS₂ Films: a Promising Liner and Barrier Alternative for Back-end-of-Line Applications

Apr 13, 2023
11:15am - 11:30am

Moscone West, Level 3, Room 3020

Tan Hao

Chandan Das

Muhammed Juvaid Mangattuchali¹,Tan Hao¹,Hippolyte Astier¹,Soumyadeep Sinha¹,Chandan Das²,John Sudijono²,Silvija Gradečak¹

NUS Singapore¹,Applied Materials, Inc.²

2D materials | atomic layer deposition

Paul Berger, The Ohio State University

Supratik Guha, The University of Chicago

Francesca Iacopi, University of Technology Sydney

Pei-Wen Li, National Yang Ming Chiao Tung University

Gold
IEEE Electron Devices Society

Mark Eriksson

Pei-Wen Li

Atomic Layer Deposition of Conformal Wafer-scale WS2 Films: a Promising Liner and Barrier Alternative for Back-end-of-Line Applications