Low-Temperature Direct Bonding of Diamond—Approach for Fabricating Low-Thermal-Resistance Widegap Devices

When and Where

Nov 29, 2023
11:00am - 11:30am

Hynes, Level 2, Room 210

Presenter(s)

Naoteru Shigekawa

Ryo Kagawa

Jianbo Liang

Yasuo Shimizu

Yutaka Ohno

Yasuyoshi Nagai

Co-Author(s)

Naoteru Shigekawa¹,Ryo Kagawa¹,Jianbo Liang¹,Yasuo Shimizu²,Yutaka Ohno²,Yasuyoshi Nagai²

Osaka Metropolitan University¹,Tohoku University²

Keywords

diamond | interface

Symposium Organizers

Philippe Bergonzo, Seki Diamond Systems

Chia-Liang Cheng, National Dong Hwa University

David Eon, Institut Neel

Anke Krueger, Stuttgart University

Symposium Support

Platinum
Great Lakes Crystal Technologies

Gold
Element Six

Silver
Plasmability, LLC
Qnami AG
SEKI DIAMOND SYSTEMS

Bronze
Applied Diamond, Inc.
DIAMFAB
Fraunhofer USA, Inc.

Session Chairs

Philippe Bergonzo

Stephen Goodnick

Event Supporters

2023 MRS Fall Meeting