May 8 - 13, 2022
Honolulu, Hawaii
May 23 - 25, 2022 (Virtual)
2022 MRS Spring Meeting
SB02.06.05
Development of the Flexible Conductive Bonding Method Without Any Adhesive for Wiring of Soft Robots
When and Where
May 11, 2022
9:30am - 9:45am
9:30am - 9:45am
Hilton, Mid-Pacific Conference Center, 6th Floor, South Pacific 3
Presenter(s)
Takao Someya, President, The University of Tokyo
Co-Author(s)
Masahito Takakuwa1,2,Kenjiro Fukuda2,Tomoyuki Yokota3,Daishi Inoue2,Shinjiro Umezu1,Takao Someya2,3
Waseda University1,RIKEN2,The University of Tokyo3
Keywords
bonding
Symposium Organizers
Symposium Support
Silver
Science of Soft Robots (Tokyo Institute of Technology)
Bronze
The Japan Society of Applied Physics
Science of Soft Robots (Tokyo Institute of Technology)
Bronze
The Japan Society of Applied Physics
Session Chairs
Kenjiro Fukuda
Xiaomin Xu