May 8 - 13, 2022
Honolulu, Hawaii
May 23 - 25, 2022 (Virtual)
2022 MRS Spring Meeting
MF03.13.06
Study on the Rheological Properties of Etch Resist Inks for Flexible Printed Circuit Board
When and Where
May 23, 2022
9:35am - 9:40am
9:35am - 9:40am
MF03-Virtual
Presenter(s)
Co-Author(s)
Bo-Young Kim1,Jeongah Kim1,Seong Dae Park1,Myong Jae Yoo1
Korea Electronics Technology Institute1
Symposium Organizers
Aaron Franklin, Duke University
Joseph Andrews, University of Wisconsin
Thomas Anthopoulos, King Abdullah University of Science and Technology
Cinzia Casiraghi, University of Manchester
Session Chairs
Joseph Andrews
Cinzia Casiraghi