May 8 - 13, 2022
Honolulu, Hawaii
May 23 - 25, 2022 (Virtual)
2022 MRS Spring Meeting
EQ04.06.02
Customizable Soft Vertical Interconnect Access Utilizing Micro-Perforated Elastomer Membrane for Stretchable Multi-Layered Circuits
When and Where
May 10, 2022
2:00pm - 2:15pm
2:00pm - 2:15pm
Hawai'i Convention Center, Level 3, 315
Presenter(s)
Co-Author(s)
Jiseok Seo1,2,Geonhee Kim1,2,Jinsu Yoon1,2,Hyeon Cho1,2,Dongju Jang1,2,Hanul Kim1,2,Yongtaek Hong1,2
Seoul National University1,Inter-university Semiconductor Research Center2
Keywords
composite | elastic properties | microstructure
Symposium Organizers
Gerardo Hernandez-Sosa, Karlsruhe Institute of Technology
Do Hwan Kim, Hanyang University
Tse Nga Ng, University of California, San Diego
Yong-Young Noh, Pohang University of Science and Technology
Symposium Support
Bronze
Advanced Devices & Instrumentation, a Science Partner Journal | AAAS
The Polymer Society of Korea
Advanced Devices & Instrumentation, a Science Partner Journal | AAAS
The Polymer Society of Korea
Session Chairs
Paul Blom
Mario Caironi