Chemical Mechanical Polishing Rate and Uniformity for Single-Crystalline Diamond Substrates

When and Where

Nov 29, 2022
8:00pm - 10:00pm

Hynes, Level 1, Hall A

Presenter(s)

S M Asaduzzaman

Aaron Hardy

Cristian Herrera-Rodriguez

Mark Tompkins

Timothy Grotjohn

Co-Author(s)

S M Asaduzzaman¹,Aaron Hardy²,Cristian Herrera-Rodriguez¹,Mark Tompkins²,Timothy Grotjohn^1,2

Michigan State University¹,Fraunhofer USA, Inc., Center Midwest²

Keywords

CMP (chemical mechanical processing)

Symposium Organizers

Anke Krueger, Stuttgart University

Philippe Bergonzo, Seki Diamond Systems

Chia-Liang Cheng, National Dong Hwa University

Mariko Suzuki, University of Cádiz

Symposium Support

Silver
MUEGGE GmbH
Seki Diamond Systems

Bronze
Applied Diamond, Inc.
EDP Corporation
Fine Abrasives Taiwan CO., LTD.
Fraunhofer USA, Inc.
Qnami AG

Session Chairs

Chia-Liang Cheng

Mariko Suzuki

2022 MRS Fall Meeting