Chemical Mechanical Polishing of Single Crystalline Diamond Epitaxial Layers for Electronics Applications

When and Where

Nov 29, 2022
8:00pm - 10:00pm

Hynes, Level 1, Hall A

Presenter(s)

Aaron Hardy

Cristian Herrera-Rodriguez

Matthias Muehle

Michael Becker

Edward Drown

Nina Baule

Mark Tompkins

Timothy Grotjohn

John Albrecht

Co-Author(s)

Aaron Hardy¹,Cristian Herrera-Rodriguez²,Matthias Muehle¹,Michael Becker¹,Edward Drown^1,2,Nina Baule¹,Mark Tompkins¹,Timothy Grotjohn²,John Albrecht^1,2

Fraunhofer USA Inc., Center Midwest¹,Michigan State University²

Keywords

CMP (chemical mechanical processing) | diamond | scanning probe microscopy (SPM)

Symposium Organizers

Anke Krueger, Stuttgart University

Philippe Bergonzo, Seki Diamond Systems

Chia-Liang Cheng, National Dong Hwa University

Mariko Suzuki, University of Cádiz

Symposium Support

Silver
MUEGGE GmbH
Seki Diamond Systems

Bronze
Applied Diamond, Inc.
EDP Corporation
Fine Abrasives Taiwan CO., LTD.
Fraunhofer USA, Inc.
Qnami AG

Session Chairs

Chia-Liang Cheng

Mariko Suzuki

2022 MRS Fall Meeting