April 22 - 26, 2019
Phoenix, Arizona
2019 MRS Spring Meeting
EP07.04.03
3D Sequential Technology—Reliability of Cu/low-k Interconnects at High Temperature
When and Where
Apr 24, 2019
9:30am - 9:45am
9:30am - 9:45am
PCC North, 200 Level, Room 221 B
Presenter(s)
Co-Author(s)
Chloe Guerin1,2,Sylvain Beaurepaire1,2,Vincent Jousseaume1,2,Patrice Gonon1,3,Ahmad Bsiesy1,3,Vincent Maurel1,4,Xavier Federspiel5,David Ney5,Claire Fenouillet-Beranger1,2
Université Grenoble Alpes1,CEA-LETI, MINATEC Campus2,LTM, UGA/CNRS/CEA3,CEA-INAC, MINATEC Campus4,STMicroelectronics5
Keywords
dielectric properties | thermal stresses | thin film
Symposium Organizers
Vincent Jousseaume, CEA-LETI
Silvia Armini, IMEC
Eiichi Kondoh, University of Yamanashi
Frank Mont, GLOBALFOUNDRIES
Symposium Support
ASM International NV
CEA, LETI
Entegris, Inc
TEL
CEA, LETI
Entegris, Inc
TEL
Session Chairs
Young-Chang Joo
Sean King