December 1 - 6, 2019
Boston, Massachusetts
2019 MRS Fall Meeting
MS01.09.29

Modeling and Simulation of Pore Migration in Tin Solders at High Homologous Temperatures Subjected to Large Electric Currents and Stress Gradients

When and Where

Dec 5, 2019
8:00pm - 10:00pm
Hynes, Level 1, Hall B

Presenter(s)

Co-Author(s)

Zachary Morgan1,Yongmei Jin1,Vahid Attari2,Raymundo Arroyave2

Michigan Technological University1,Texas A&M University2

Keywords

electromigration

Symposium Organizers

Avinash Dongare, University of Connecticut
Basile Audoly, CNRS et École polytechnique
Irene Beyerlein, University of California, Santa Barbara
Chiara Daraio, California Institute of Technology

Session Chairs

Irene Beyerlein

In this Session