Meetings & Events

 

2007 MRS Spring Meeting Logo2007 MRS Spring Meeting & Exhibit


April 9-13, 2007
| San Francisco
Meeting Chairs: Timothy J. Bunning, Harold Y. Hwang, Debra Kaiser, Jennifer A. Lewis

Symposium B : Materials, Processes, Integration, and Reliability in Advanced Interconnects for Micro- and Nano-Electronics

2007-04-10   Show All Abstracts

Symposium Organizers

Qinghuang Lin IBM T. J. Watson Research Center
Wen-li Wu National Institute of Standards and Technology
E. Todd Ryan Advanced Micro Devices IBM - Albany NanoTech
Do Yeung Yoon Seoul National University
B1: Dielectric Materials I
Session Chairs
Qinghuang Lin
E. Ryan
Tuesday AM, April 10, 2007
Room 3002 (Moscone West)

9:15 AM -
Opening Remarks

9:30 AM - **B1.1
Vapor Deposition of Pore-Sealing, Barrier, Adhesion and Seed Layers for Interconnects.

Roy Gordon 1 , Huazhi Li 1 , Zhengwen Li 1 , Daewon Hong 1 , Damon Farmer 2 , Youbo Lin 2 , Joost Vlassak 2 , Daniel Josell 3 , Thomas Moffat 3 , Christian Witt 4
1 Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts, United States, 2 Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts, United States, 3 Metallurgy Division, National Institute of Standards and Technology, Gaithersberg, Maryland, United States, 4 TJ Watson Research Center, IBM, Yorktown Heights, New York, United States

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10:00 AM - **B1.2
Interface with High Adhesive and Cohesive Strength Between SiCOH Dielectrics and SiCHN Caps.

Alfred Grill 1 , Dan Edelstein 1 , Michael Lane 1 , Vishnubhai Patel 1 , Stephen Gates 1 , Darryl Restaino 2 , Steven Molis 2 , Nancy Klymko 2 , Kang Yim 3 , V. Nguyen 3 , Alex Demos 3 , Steven Reiter 3 , Hichem M'Saad 3
1 , IBM - T.J.Watson Res.Ctr., Yorktown Heights, New York, United States, 2 , IBM SRDC, Hopewell Junction, New York, United States, 3 , Applied Materials, Santa Clara, California, United States

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10:30 AM - **B1.3
Interfacial Organic Layers: Tailored Surface Chemistry for Nucleation and Growth of Inorganic Barrier Layer Materials.

James Engstrom 1
1 Chemical Engineering, Cornell University, Ithaca, New York, United States

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11:00 AM - *
Break

11:30 AM - **B1.4
Formation of Porous Organosilicate Glasses Produced by PECVD and UV Curing

Mark O'Neill 1 , Patrick Hurley 1 , Scott Weigel 1 , Mary Haas 1 , Brian Peterson 1 , Raymond Vrtis 1 , Dingjun Wu 1 , Steven Mayorga 1
1 Electronics Technology, Air Products and Chemicals, Inc., Allentown, Pennsylvania, United States

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12:00 PM - B1.5
Remote Plasma Assisted Atomic Layer Deposition of Ultra-thin Pore-sealing for Self-assembled Porous Low-k Materials

Ying-Bing Jiang 1 , George Xomeritakes 2 , Zhu Chen 2 , Darren Dunphy 1 , Jiebin Pang 2 , Eric Branson 1 , Joseph L. Cecchi 2 , C. Jeffrey Brinker 1 2
1 , Sandia National Labs, Albuquerque, New Mexico, United States, 2 , Univ. of New Mexico, Albuquerque, New Mexico, United States

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12:15 PM - B1.6
Ash-free Porogen for Ultralow Spin-On-Dielectrics

Kun Woo Park 1 , Tae Hoon Lee 1 , Gun Woo An 1 , Sung Kyu Min 2 , Bong Jin Moon 3 , Do Young Yoon 4 , Hee Woo Rhee 1
1 Chemical & Biomolecular Engineering, Sogang University, Seoul Korea (the Republic of), 2 Thin Film Team, Hynix Semiconductor Inc., Icheon, Kyunggido, Korea (the Republic of), 3 Chemistry, Sogang University, Seoul Korea (the Republic of), 4 Chemistry, Seoul National University, Seoul Korea (the Republic of)

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12:30 PM - **B1.7
Robust Ultra-Low K and Directly Patterned Interlayer Dielectrics Prepared by Templating Processes.

James Watkins 1
1 Polymer Science and Engineering, University of Massachusetts, Amherst, Massachusetts, United States

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B2: Dielectric Materials II
Session Chairs
Wen-li Wu
Do Yoon
Tuesday PM, April 10, 2007
Room 3002 (Moscone West)

2:30 PM - **B2.1
Requirements and Constraints on Optimizing UV Processing of Low-k Dielectrics.

Ivan Berry 1 , Carlo Waldfried 1 , Kevin Durr 1
1 , Axcelis Technologies, Beverly, Massachusetts, United States

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3:00 PM - B2.2
Understanding the Role of UV Cure on Enhancing Glass Structure and Mechanical Reliability of Porous Low-k Thin Films.

David Gage 1 , Jonathan Stebbins 2 , Zhenjiang Cui 3 , Amir Al-Bayati 3 , Alex Demos 3 , Kenneth MacWilliams 3 , Reinhold Dauskardt 1
1 Materials Science and Engineering, Stanford University, Stanford, California, United States, 2 Geological and Environmental Sciences, Stanford University, Stanford, California, United States, 3 , Applied Materials, Inc., Santa Clara, California, United States

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3:15 PM - B2.3
The Effect of Ultraviolet Light Curing on the Fracture Properties of a k~2.5 Low-k Dielectric.

Ryan Smith 1 , Ting Tsui 2 , Paul Ho 1
1 Material Science and Engineering, University of Texas at Austin, Austin, Texas, United States, 2 Silicon Technology Development, Texas Instruments, Inc., Dallas, Texas, United States

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3:30 PM - B2.4
Structural Transformation During Porogen Removal Under Ultraviolet Assisted Thermal Curing on PECVD Porous Ultra low-k Material.

Aziz Zenasni 1 , Laurent Favennec 2 , Vincent Jousseaume 1 , Olivier Gourhant 2 , Julien Fort 3 , Patrick Maury 2 , Lucile Mage 1 , Samphy Hong 3 , Gerard Passemard 2
1 LETI-D2NT-LBE, CEA, Grenoble France, 2 , STMicroelectronics, Crolles France, 3 , Applied Materials, Meylan France

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3:45 PM - B2.5
Self-organized Nanostructures by Atmospheric Microplasma Processing.

Davide Mariotti 1 , Yoshiki Shimizu 1 , Vladimir Svrcek 1 , Dae-Gun Kim 1 , Takeshi Sasaki 1 , Naoto Koshizaki 1
1 NARC, AIST, Tsukuba, Ibaraki, Japan

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4:00 PM - *
break

4:30 PM - **B2.6
The Role of Pore Characterization in the Challenge to Integrate Porous low-k Dielectrics

David Gidley 1 , Richard Vallery 1 , Ming Liu 1
1 Physics, University of Michigan, Ann Arbor, Michigan, United States

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5:00 PM - B2.7
Mechanical Impacts of Templating Polystyrene Porogen in Methylsilsesquioxane.

Markus Ong 1 , Geraud Dubois 2 , Willi Volksen 2 , Robert Miller 2 , Reinhold Dauskardt 1
1 Materials Science and Engineering, Stanford University, Stanford, California, United States, 2 Almaden Research Center, IBM, San Jose, California, United States

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5:15 PM - B2.8
Atomic-Scale Analysis of Structural and Mechanical Properties of Amorphous Microporous and Mesoporous Silica Thin Films.

M. Rauf Gungor 1 , James Watkins 2 1 , Dimitrios Maroudas 1
1 Department of Chemical Engineering, University of Massachusetts, Amherst, Massachusetts, United States, 2 Department of Polymer Science and Engineering, University of Massachusetts, Amherst, Massachusetts, United States

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5:30 PM - B2.9
Organic-Functionalized Pure-Silica-Zeolite MFI and MEL Films for Low-Dielectric Constant Applications.

Christopher Lew 1 , Zijian Li 1 , Shuang Li 1 , Sonjong Hwang 2 , Dora Medina 1 , Minwei Sun 1 , Mark Davis 2 , Yushan Yan 1
1 Chemical and Environmental Engineering, University of California, Riverside, Riverside, California, United States, 2 Chemical Engineering, California Institute of Technology, Pasadena, California, United States

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5:45 PM - B2.10
Damage-free Etching Processes of Low Dielectric (Low-k) Films Using the Neutral Beam

Butsurin Jinnai 1 , Seiji Samukawa 1
1 Institute of Fluid Science, Tohoku University, Sendai, Miyagi, Japan

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B3: Poster Session: Dielectric Materials
Session Chairs
Tuesday PM, April 10, 2007
Salon Level (Marriott)

9:00 PM - B3.1
Mechanical Properties and Fracture of Ultra-low-k (ULK) Nanoporous Organosilicate Glass Coatings with Varied Porosities.

Youbo Lin 1 , Han Li 1 , Joost Vlassak 1
1 , Harvard University, Cambridge, Massachusetts, United States

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9:00 PM - B3.10
Effect of He, Ar, O2 Plasma Treatments on the Electrical and Chemical Properties low-k SiCOH Film Deposited by PECVD.

Sungwoo Lee 1 , Jaeyoung Yang 1 , Changrok Choi 1 , Sangmin Do 1 , Heeyeop Chae 2 , Donggeun Jung 1 , Jim-hyo Boo 3 , Hyoungsub Kim 4
1 Physics, sungkyunkwan University, Suwon, Gyunggi, Korea (the Republic of), 2 Chemical engnieering, Sungkyunkwan University, Suwon, Gyunggi, Korea (the Republic of), 3 Chemistry, sungkyunkwan University, Suwon, Gyunggi, Korea (the Republic of), 4 Materials Engineering, Ssungkyunkwan University, Suwon, Gyunggi, Korea (the Republic of)

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9:00 PM - B3.11
Optical Absorption and Characteristics of Low-k Films and Barrier Layers in the Ultra-Violet Range

Salvador Eslava 1 2 , Guillaume Eymery 1 , Mikhail Baklanov 1 , Francesca Iacopi 1 , Francesca Clemente 1 , Carlo Carbonaro 3 , Philippe Foubert 1 , Karen Maex 1 2
1 , IMEC, Leuven Belgium, 2 ESAT, Katholieke Univ. Leuven, Leuven Belgium, 3 Dept. of Physics, Cagliari Univ., Monserrato Italy

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9:00 PM - B3.12
Effects of CH4 Plasma Treatment on Porous Organosilicate Low-k Dielectrics

Hualiang Shi 1 , Junjing Bao 1 , Junjun Liu 2 , Huai Huang 1 , Paul S. Ho 2
1 Physics, The University of Texas at Austin, Austin, Texas, United States, 2 Material Science, The University of Texas at Austin, Austin, Texas, United States

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9:00 PM - B3.13
Spin-on Barrier-dielectric/CMP-cap for Cu/low-k Interconnect.

Shin-ya Arase 1 , Nobuhide Maeda 1 , Yoshio Takimoto 1 , Hiroshi Kawakami 1 , Kouji Sumiya 3 , Yoshio Homma 1 , Hidenori Saito 2 , Masahiro Tada 2 , Terukazu Kokubo 3
1 , Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT), Kokubunji, Tokyo, Japan, 3 , JSR Corporation, Ltd., Tsukuba, Ibaraki, Japan, 2 , Sumitomo Bakelite Co., Ltd., Yokohama, Kanagawa, Japan

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9:00 PM - B3.15
Effect of Environment on the Modulus of low-k Porous ILD Films Used in the BEOL.

Eva Simonyi 1 , Christos Dimitrakopoulos 1 , Stephen Gates 1 , Michael Lane 1 , Eric Liniger 1
1 , IBM, Yorktown Heights, New York, United States

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9:00 PM - B3.16
Dry Etching of SiC with CF4/Ar Inductively Coupled Plasmawith a Photoresist Mask.

Jie Lu 1 , Chris Thomas 1 , Mvs Chandrashekhar 1 , Michael Spencer 1
1 Electrical and Computer Engineering, Cornell University, Ithaca, New York, United States

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9:00 PM - B3.17
The Impact of Dielectric Films and Post-Metal Etch Wet Treatment on Charge-Induced Corrosion of Tungsten Vias.

Szetsen Lee 1 , Chi-Jung Ni 2
1 Chemistry, Chung Yuan Christian University, Chungli Taiwan, 2 Module Technology Development, Winbond Electronics, Hsinchu Taiwan

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9:00 PM - B3.18
Synthesis and Characterization of Porogen-bridged Silsesquioxane Monomers and Their Application to Ultralow-k Films

Woojin Lee 1 , Jae Hwan Sim 1 , David Gidley 2 , Do Y. Yoon 1
1 Department of Chemistry, Seoul National University, Seoul Korea (the Republic of), 2 Department of Physics, University of Michigan, Ann Arbor, Michigan, United States

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