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Symposium SB09-Polymeric Electronic Materials and Devices for Biological Interfaces

Recent advances in electronic materials and devices have created bioelectronics that enable new functions to sense, stimulate, control, and re-engineer the biosystems. However, living biological systems involve dynamic movement from the three-dimensional (3D) tissues and organs with genetically defined different types of cells all connected together, which are difficult to be interfaced by conventional electronic devices. Resolving these challenges would require new efforts in the development of materials and devices. This symposium will focus on the development of advanced polymeric electronic materials and devices to address the challenges. Examples include intrinsically stretchable and tissue-level soft bioelectronics for long-term stable, gliosis-free biointerface, chronically stably recording cellular-level activities. Self-healable, tough adhesive and shape-morphing devices for adapting to the dynamic evolving and changing environment of the biological system. Genetically encoded polymeric electronics for genetically targeted biointerface. Dual conductive polymeric electronic materials for low impedance bioelectric interface and neuromorphic devices. These methods span across a broad spectrum of materials science and device engineering, leading to polymeric electronic tools for bio-integration at multiple length scales with unprecedented opportunities and addressing many urgent demands spanning from artificial skins, wearable and implantable electronics, neuroscience, tissue engineering, and other areas.

Topics will include:

  • Synthesis and characterization of polymeric electronic materials
  • Fabrication of polymeric devices for biointegration
  • Biocompatibility of polymeric electronic materials and devices
  • Intrinsically stretchable and tissue-level soft bioelectronics
  • Implantable bioelectronics
  • Genetically targeted and cell-type-specific bioelectronics
  • Living bioelectronics built from polymeric materials
  • Self-healable, tough adhesive and shape-morphing bioelectronics

Invited Speakers:

  • Polina Anikeeva (Massachusetts Institute of Technology, USA)
  • Zhenan Bao (Stanford University, USA)
  • Madhu Bhaskaran (RMIT University, Austria)
  • Wenlong Cheng (Monash University, Australia)
  • Xiaojie Duan (Peking University, China)
  • John Ho (National University of Singapore, Singapore)
  • YongAn Huang (Huazhong University of Science and Technology, China)
  • Jae-woong Jeong (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Dion Khodagholy (Columbia University, USA)
  • Stéphanie P. Lacour (École Polytechnique Fédérale de Lausanne, Switzerland)
  • Nan Liu (Beijing Normal University, China)
  • Nanshu Lu (The University of Texas at Austin, USA)
  • George Malliaras (University of Cambridge, United Kingdom)
  • Iain McCulloch (University of Oxford, United Kingdom)
  • Le Floch Paul (Axoft, Inc., USA)
  • Mikyung Shin (Sungkyunkwan University, Republic of Korea)
  • Takao Someya (The University of Tokyo, Japan)
  • Eleni Stavrinidou (Linköping University, Sweden)
  • Bozhi Tian (The University of Chicago, USA)
  • Helen Tran (University of Toronto, Canada)
  • Nicolas Vachicouras (Neurosoft Bioelectronics, Switzerland)
  • Cunjiang Yu (University of Houston, USA)
  • Hyunwoo Yuk (SanaHeal, USA)
  • Haijun Zhang (Shandong Baiduoan Medical Equipment Co., Ltd., China)
  • Ting Zhang (Suzhou Institute of Nanotechnology and Nano-Bionics, Chinese Academy of Sciences, China)
  • Xuanhe Zhao (Massachusetts Institute of Technology, USA)

Symposium Organizers

Jia Liu
Harvard University
School of Engineering and Applied Sciences
USA
No Phone for Symposium Organizer Provided , jia_liu@seas.harvard.edu

Lihua Jin
University of California, Los Angeles
Department of Mechanical and Aerospace Engineering
USA
No Phone for Symposium Organizer Provided , lihuajin@seas.ucla.edu

Jiheong Kang
Korea Advanced Institute of Science and Technology
Dept. of Materials Science and Engineering
Republic of Korea
No Phone for Symposium Organizer Provided , jiheongkang@kaist.ac.kr

Zhiyuan Liu
Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences
China
No Phone for Symposium Organizer Provided , zy.liu1@siat.ac.cn

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