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Symposium EL18-Material, Device, and Fabrication Innovations for Flexible, Stretchable, and Printed Electronics

The rapidly growing desire of integrating electronics with human bodies for ubiquitous healthcare and communication applications has generated a new wave in the development of electronics, that is to achieve human-compatible mechanical flexibility and stretchability. In the meantime, to support the expanded uses of such electronics, large-area and low-cost manufacturing are also needed, for which, solution printing is the most appealing avenue. In recent years, significant progress has been made in the creation of new functional materials and device designs to achieve flexible and/or stretchable properties, and solution-printing capability, which expand to semiconductors, conductors, dielectrics, gels, various types of sensors and energy harvesters, light-emitting diodes, actuators, transistors, and circuits. These advancements have been coming from both inorganic electronics and organic/polymeric electronics, based on different types of design strategies. This symposium will provide a venue for the discussion of both fundamental and applied research progresses in this broad field, with the topics expanding from the design of mechanically soft, flexible, stretchable, and printable materials, and functional devices; to the development of new fabrication approaches for high-density, large-area electronics, especially printing-based methods; and the emerging applications for interfacing with human bodies and biological systems as wearable or implantable devices.

Topics will include:

  • Flexible, stretchable and printable designs of inorganic and organic conductors, semiconductors, dielectrics, electroluminescent materials
  • Flexible, stretchable, and printable transistors and circuits
  • Flexible and stretchable, and printable pressure, strain, tactile, electrophysiological, chemical, optical, temperature sensors
  • Flexible and stretchable, and printable energy devices, including solar cells, thermoelectric devices, etc.
  • Advanced printing technological for electronics, including 3D printing, aerosol printing, electrospinning, roll-to-roll printing, etc.
  • System integration of flexible, stretchable, and printable electronics for wearable, bio-interfaced, soft robotic applications
  • Soft electronics with other bioinspired properties, such as transient, healable, trainable properties
  • A tutorial complementing this symposium is tentatively planned.

Invited Speakers:

  • Zhenan Bao (Stanford University, USA)
  • Derya Baran (King Abdullah University of Science and Technology, Saudi Arabia)
  • Magnus Berggren (Linköping University, Sweden)
  • Mariano Campoy-Quiles (Institute of Materials Science of Barcelona, Spain)
  • Xiaodong Chen (Nanyang Technological University, Singapore)
  • Ying Diao (University of Illinois at Urbana-Champaign, USA)
  • Aristide Gumyusenge (Massachusetts Institute of Technology, USA)
  • Dae-Hyeong Kim (Seoul National University, Republic of Korea)
  • Do Hwan Kim (Hanyang University, Republic of Korea)
  • Stéphanie P. Lacour (École Polytechnique Fédérale de Lausanne, Switzerland)
  • Ying-Chih Lai (National Cheng Kung University, Taiwan)
  • Pooi See Lee (Nanyang Technological University, Singapore)
  • Chenghui Li (Nanjing University, China)
  • Zong-Hong Lin (National Tsing Hua University, Taiwan)
  • Nan Liu (Beijing Normal University, China)
  • Yuxin Liu (National University of Singapore, Singapore)
  • George Malliaras (University of Cambridge, United Kingdom)
  • Jianguo Mei (Purdue University, USA)
  • Joon Hak Oh (National Seoul University, Republic of Korea)
  • Qibing Pei (University of California, Los Angeles, USA)
  • Luisa Petti (Free University of Bozen-Bolzan, Italy)
  • Jonathan Rivnay (Northwestern University, USA)
  • John A. Rogers (Northwestern University, USA)
  • Robert F. Shepherd (Cornell University, USA)
  • Takao Someya (The University of Tokyo, Japan)
  • Vincent C. Tung (King Abdullah University of Science and Technology, Saudi Arabia)
  • Jie Xu (Argonne National Laboratory, USA)
  • Wentao Xu (Nankai University, China)
  • Tomoyuki Yokaota (The University of Tokyo, Japan)
  • Xuanhe Zhao (Massachusetts Institute of Technology, USA)

Symposium Organizers

Sihong Wang
The University of Chicago
Pritzker School of Molecular Engineering

Ho-Hsiu Chou
National Tsing Hua University
No Phone for Symposium Organizer Provided , hhchou@mx.nthu.edu.tw

Francisco Molina-Lopez
KU Leuven
Materials Engineering Department
No Phone for Symposium Organizer Provided , francisco.molinalopez@kuleuven.be

Xuzhou Yan
Shanghai Jiao Tong University
School of Chemistry and Chemical Engineering
No Phone for Symposium Organizer Provided , xzyan@sjtu.edu.cn

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