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Call for Papers

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Deadline: October 28, 2021, 11:59 pm EDT

Symposium EQ06—Surfaces and Interfaces in Electronics and Photonics

Surfaces and interfaces have become increasingly important factors for the integration of emerging materials and the implementation of latest fabrication processes into new generation of electronic and photonic devices. When interfaces are formed at the junction between materials surfaces with dissimilar properties, surprising new properties not present in either parent phase emerge at the intersection. These intriguing interfacial properties play key roles in organizing the multilayered device structures and modulating the charge-transfer dynamics across connecting layers. As system dimensions are scaled downward for future electronic device applications and heterogeneous integration of inorganic and organic surfaces are getting prevalent in wearable devices, the nature and complexity of materials interfaces bring tremendous challenges to scientists and engineers resulting in slowing down the progress towards emerging applications. Advanced characterization techniques to study these complex interfaces accurately are also rare. Methods of film and surface preparation and interface formation are often coupled, and they significantly affect the operation of devices. Thus, this symposium is aimed at bringing together experts in the different aspects of materials surfaces and interfaces ranging from advanced characterization, to unconventional film-growth, patterning and device level integration. Both experimental and theoretical papers are welcome. Special emphasis will be given to papers in areas of in-situ characterization techniques as well as modelling and multiscale simulations.

Topics will include:

  • Interfaces in area-selective ALD enabled nanopatterns
  • Self-assembled monolayers (SAM) growth and in-situ characterization
  • Next generation interconnects-interfacial challenges
  • Surface activation, deactivation, patterning, and spectroscopic studies
  • Mechanistic understanding of interface defect formation and mitigation
  • Surface characterization techniques and metrology innovation
  • Hybrid (inorganic/organic) interfaces in flexible electronics and additive manufacturing
  • Interfacial challenges in printed hybrid electronics
  • Emerging deposition equipments
  • Control of surfaces, interfaces and grain-boundaries to tailor properties and functionalities
  • Surfaces of emerging electronic and photonic materials
  • Interface engineering in emerging photovoltaics including perovskites

Invited Speakers (tentative):

  • Ana Claudia Arias (University of California, Berkeley, USA)
  • Julien Bachmann (Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany)
  • Katherine Develos Bagarinao (National Institute of Advanced Industrial Science and Technology, Japan)
  • Derya Baran (King Abdullah University of Science and Technology, Saudi Arabia)
  • Stacey Bent (Stanford University, USA)
  • Charles Black (Brookhaven National Laboratory, USA)
  • Jane P. Chang (University of California, Los Angeles, USA)
  • John Conley (Oregon State Universtiy, USA)
  • Catherine Dubourdieu (Helmholtz-Zentrum Berlin für Materialien und Energie, Germany)
  • Lara A. Estroff (Cornell University, USA)
  • Steven George (University of Colorado Boulder, USA)
  • Angel Yanguas Gil (Argonne National Laboratory, USA)
  • Oki Gunawan (IBM T.J. Watson Research Center, USA)
  • Dipti Gupta (Indian Institute of Technology Bombay, India)
  • Melissa Hines (Cornell University, USA)
  • Erwin Kessels (Technische Universiteit Eindhoven, Netherlands)
  • Rebecca Kramer-Bottiglio (Yale University, USA)
  • Andrew C. Kummel (University of California, San Diego, USA)
  • Stéphanie P. Lacour (École Polytechnique Fédérale de Lausanne, Switzerland)
  • Adrie Mackus (Eindhoven University of Technology, Netherlands)
  • George Malliaras (University of Cambridge, United Kingdom)
  • Tse Nga Ng (University of California, San Diego, USA)
  • Sang-Hee Park (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Riikka Puurunen (Aalto University, Finland)
  • Danna Rosenberg (Massachusetts Institute of Technology, USA)

Symposium Organizers

Santanu Bag
Air Force Research Laboratory
Materials and Manufacturing Directorate
USA

Silvia Armini
imec
Belgium

Mandakini Kanungo
Corning Incorporated
USA

Hong Zhao
Virginia Commonwealth University
Department of Mechanical and Nuclear Engineering
USA

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