9:30 AM - EN03.12.06
Late News: Understanding Thermal Transport in Polymer-based Composites
Yijie Zhou1,Yanfei Xu1
University of Massachusetts Amherst1
Show Abstract
Polymer-based thermal interface materials play key roles in thermal management applications thanks to their unique combination of properties not available from any other known materials.1-3 They are lightweight, corrosion-resistant, easy to process, and among others. However, common polymers are thermal insulators with low thermal conductivity on the order of 0.1 Wm-1 K-1.4,5 To achieve high thermal conductivity in polymers, highly thermally conductive fillers such as graphene and nano-diamond powder have been added into polymers.6-9 Although polymers are blended with highly thermally conductive fillers (e.g. silver nanoparticle ~400 Wm-1 K-1) at a high loading volume fraction of 70 vol%, thermal conductivity in polymer-based composites is limited to ~5 Wm-1 K-1.10 This is because low thermal conductivities in common polymer matrices, high thermal interface resistance between filler and polymer, and high thermal interface resistance between filler and filler.3,11 In this poster, we will present our current research on developing polymer-based thermal interface materials. To increase effective thermal conductivity in polymer-based composites, we strive to increase thermal conductivity in pure polymer matrices (e.g. polyethylene, polyvinyl alcohol, and epoxy) and reduce thermal interface resistances between fillers and polymers by enhancing vibrational couplings. We believe that polymer-based thermal interface materials will play a key role in many existing and unforeseen thermal management applications.
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