2018 MRS Fall Meeting Home

Symposium TP02—Thermal AnalysisMaterials, Measurements and Devices

Thermal analysis determines the physical and chemical properties of materials. It provides insights into chemical bonding, microstructure, order-disorder reactions, and phase transitions, and how these respond to thermal and processing history. Recent advances in instrumentation, techniques and applications have facilitated new areas of study, as well as allowing old questions to be re-addressed, especially with the progress in ultrafast scanning and micro- and nanocalorimetry. These new methods are being applied to measurements of thin films, glasses, semiconductors, nanomaterials, biomaterials, and reactive and energetic materials. Propagating ideas across different materials classes will facilitate the development of new products and enhance the measurement capabilities for thermal analysis.

Designing high performance and cost competitive electronics requires careful consideration of not only electrical but also thermal domains, and this symposium will serve as a bridge between semiconductors/devices and thermal analysis. This symposium will provide a platform for worldwide scientists/researchers to discuss thermal properties of various materials, novel measurement methods for thermal analysis including integration with other methods (e.g. TEM, ToFMS, XRD) and combinatorial methods, and thermal management of devices.

Topics will include:

  • Fast scanning thermal analysis and instrumentation metrology
  • Micro- and nano-scale thermal analysis
  • Thermal behavior of nanoconfined glasses or crystallizable materials
  • Thermal characterization of semiconductors and nanoelectronic devices
  • Thermal characterization of 2D layered materials and clusters
  • Thermal characterization of biomaterials, protein-folding
  • Thermochemical properties of inorganic and hybrid materials
  • Thermodynamics, kinetics in thermal analysis
  • Combinatorial methods for thermal analysis
  • Thermal characterization of reactive and energetic materials
  • Prediction of lifetime based on thermal analysis
  • A tutorial complementing this symposium is tentatively planned.

Invited Speakers:

  • Rene Androsch (Martin Luther University, Germany)
  • Thomas Beechem (Sandia National Laboratories, USA)
  • John Bischof (University of Minnesota, USA)
  • Peggy Cebe (Tufts University, USA)
  • Andrea Centrone (National Institute of Standards and Technology, USA)
  • Sukwon Choi (The Pennsylvania State University, USA)
  • Jeffery DeLisio (Charles Stark Draper Laboratory, USA)
  • Frances Hellman (University of California, Berkeley, USA)
  • Greg McKenna (Texas Tech University, USA)
  • Alexandra Navrotsky (University of California, Davis, USA)
  • John Perepezko (University of Wisconsin-Madison, USA)
  • James Pomeroy (University of Bristol, United Kingdom)
  • Christoph Schick (University of Rostock, Germany)
  • Ali Shakouri (Purdue University, USA)
  • Akihiko Toda (Hiroshima University, Japan)
  • Javier Rodriguez Viejo (University of Barcelona, Spain)
  • Joost Vlassak (Harvard University, USA)
  • Mary Anne White (Dalhousie University, Canada)
  • Yoonjin Won (University of California, Irvine, USA)
  • Zichao Ye (University of Illinois at Urbana-Champaign and Lam Research Corporation)
  • Lian Yu (University of Wisconsin-Madison, USA)
  • Zhiwu Yu (Tsinghua University, China)

Symposium Organizers

Feng Yi
National Institute of Standards and Technology
Material Measurement Laboratory

Leslie Allen
University of Illinois at Urbana
Materials Science Department

Martin Kuball
University of Bristol
Center for Device Thermography and Reliability
United Kingdom

Sindee Simon
Texas Tech University
Department of Chemical Engineering

Keywords for Abstract Submission

Calorimetry, Combinatorial metrology, Device reliability, Fast scanning nanocalorimetry, Nanoelectronic metrology, Thermal analysis, Thermodynamics and kinetics of materials

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