Symposium TP02—Thermal Analysis—Materials, Measurements and Devices
Thermal analysis determines the physical and chemical properties of materials. It provides insights into chemical bonding, microstructure, order-disorder reactions, and phase transitions, and how these respond to thermal and processing history. Recent advances in instrumentation, techniques and applications have facilitated new areas of study, as well as allowing old questions to be re-addressed, especially with the progress in ultrafast scanning and micro- and nanocalorimetry. These new methods are being applied to measurements of thin films, glasses, semiconductors, nanomaterials, biomaterials, and reactive and energetic materials. Propagating ideas across different materials classes will facilitate the development of new products and enhance the measurement capabilities for thermal analysis.
Designing high performance and cost competitive electronics requires careful consideration of not only electrical but also thermal domains, and this symposium will serve as a bridge between semiconductors/devices and thermal analysis. This symposium will provide a platform for worldwide scientists/researchers to discuss thermal properties of various materials, novel measurement methods for thermal analysis including integration with other methods (e.g. TEM, ToFMS, XRD) and combinatorial methods, and thermal management of devices.