Symposium Organizers
Stéphanie P. Lacour University of Cambridge
Barclay Morrison Columbia University
Takao Someya University of Tokyo
John Rogers University of Illinois-Urbana Champaign
Symposium Support
ALA Scientific Instruments, Inc
Multi Channel Systems
Nokia Corp
Plexon Inc
M1: Conformable Electronic Systems
Session Chairs
Tuesday PM, March 25, 2008
Room 2011 (Moscone West)
9:30 AM - **M1.1
Stretchable, Large-area Active Matrixes Comprising Organic Transistors for the Application to the Electrical Artificial Skins.
Tsuyoshi Sekitani 1 , Yoshiaki Noguchi 1 , Takao Someya 1
1 , The University of Tokyo, Tokyo Japan
Show Abstract10:00 AM - M1.2
Medium-Scale Integrated Digital Circuits Based on Nanotube Thin-Film Transistors on Plastic Substrates.
Qing Cao 1 3 4 , John Rogers 2 3 4
1 Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States, 3 Frederick Seitz Materials Research Lab, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States, 4 Beckman Institute, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States, 2 Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States
Show AbstractCarbon nanotube thin-film transistors have been demonstrated to exhibit excellent electrical, mechanical and optical properties with compatibility with various substrates including low-cost flexible plastics. The next step is to integrate those transistors in a scalable fashion to achieve functional circuits. Here we show that high-performance top-gate nanotube transistors can be fabricated on plastics based on a transfer printing technique and high k gate dielectrics in over 95% yield with controllable and predictable electrical properties. Those transistors are then configured as key NOT, NOR, NAND logic gates and can realize larger scale of integration with the demonstration of a 4:16 row decoder composed of 88 transistors.
10:15 AM - M1.3
Flexible Logic Circuit Applications with ZnO-pentacene Hybrid Complementary TFT Inverters on Polymeric Substrate.
Min Suk Oh 1 , Kimoon Lee 1 , Seongil Im 1
1 Institute of Physics and Applied Physics, YONSEI University, Seoul Korea (the Republic of)
Show Abstract10:30 AM - **M1.4
Integrate or Laminate: Materials Challenges in Flexible Electronic Surfaces.
Sigurd Wagner 1
1 Electrical Engineering, Princeton University, Princeton, New Jersey, United States
Show Abstract11:00 AM - M1: Systems
BREAK
Symposium Organizers
Stéphanie P. Lacour University of Cambridge
Barclay Morrison Columbia University
Takao Someya University of Tokyo
John Rogers University of Illinois-Urbana Champaign
M8: Process
Session Chairs
Wednesday PM, March 26, 2008
Room 2011 (Moscone West)
3:00 PM - M8.1
Double-flip transfer of InP onto Flexible Substrates.
Wayne Chen 1 , Peng Chen 1 , S. Lau 1 , T. Alford 2 , T. Kuech 3
1 Electrical and Computer Engineering, University of California San Diego, La Jolla, California, United States, 2 School of Materials, Arizona State University, Tempe, Arizona, United States, 3 Department of Chemical and Biological Engineering, University of Wisconsin, Madison, Madison, Wisconsin, United States
Show Abstract3:15 PM - M8.2
Fabrication, Manipulation, and Folding/Unfolding of Coiled Si/SiGe Structures in Solution.
Minrui Yu 1 , Hua Qin 1 , Nakul Shaji 1 , Don Savage 1 , Max Lagally 1 , Robert Blick 1
1 , University of Wisconsin-Madison, Madison, Wisconsin, United States
Show AbstractWe study the design and fabrication of various 3D micro-structures using Si/SiGe thin film materials. A strain induced by lattice mismatch between the Si and Ge layers causes the bilayer to curl when released from the substrate. By carefully controlling the pattern and material properties, we can fabricate a variety of shapes such as tubes, helices, or partially curved membranes on the micro- and nano-meter scale. For the tubes, we use a Focused Ion Beam (FIB) to cut open a cross section to reveal the nature of the bonding between two adhesing bilayers. For the helices and curved membranes, we use surface tension caused by chemical binding to change their curvature. We also investigate ways to manipulate these structures in liquids. Since they are geometrically anisotropic, strong electric dipole can be induced under non-uniform field and can be used to move them precisely. Moreover, as a semiconductor material, these structures can be readily integrated with the IC technology to make 3D electronic devices. Combining the maneuverability with the ability to change shapes based on surface chemical interaction with their environments, these devices can be used as deplorable chemical and biological sensors. They can also be used in drug delivery to release drugs, or in biopsy to retrieve tissue samples.
3:30 PM - M8.3
The Effect of Plasma Treatment on the SiO2 film fabricated without Substrate Heating for Flexible Electronics.
Sun-Jae Kim 1 , Sang-Myeon Han 1 , Seung-Hee Kuk 1 , Dong-Won Kang 1 , Min-Koo Han 1
1 , Seoul National University, Seoul Korea (the Republic of)
Show Abstract
Symposium Organizers
Stéphanie P. Lacour University of Cambridge
Barclay Morrison Columbia University
Takao Someya University of Tokyo
John Rogers University of Illinois-Urbana Champaign
M15: Poster Session: Sensing on Flexible Substrates
Session Chairs
Thursday PM, March 27, 2008
Salon Level (Marriott)
9:00 PM - M15.1
Growth of Dissociated Spinal Cord Cultures on Stretchable Microelectrode Arrays.
Irene Hu 1 , Oliver Graudejus 1 , Joyelle Jones 1 , Melinda Kutzing 2 , Bonnie Firestein 2 , Sigurd Wagner 1
1 Electrical Engineering, Princeton University, Princeton, New Jersey, United States, 2 Cell Biology and Neuroscience, Rutgers University, Piscataway, New Jersey, United States
Show AbstractWe describe experiments for introducing stretchable microelectrode arrays (SMEAs) as a research tool to study spinal cord injury. The basic structure of SMEAs is (i) an elastomeric substrate of poly hexamethyl disiloxane (PDMS), (ii) an elastic thin-film metallization patterned as needed by the application, and (iii) an overlayer of stretchable encapsulation and electrical insulation, patterned with vias to allow electrode contact with tissue and interconnects with stimulation and recording electronics. To use SMEAs as a tool for studying the effects of spinal cord injury from mechanical shock, spinal cord cells must adhere well to the array during the injury event. To assure this adherence, the cells, after extraction from rat embryos and dissociation, are cultured on the arrays for six days prior to injury. Thus, the arrays must also be capable of sustaining healthy cell growth. To conduct fast turnaround tests of cell adhesion we are initially growing cultures on membranes composed of only elastomeric substrate coated with the silicone-based photopatternable encapsulation. We are using samples as-prepared and after a variety of surface treatments. We determine cell viability by counting the number of surviving, healthy cells relative to a control of cells grown in a plastic well with no membrane. In a second step we are culturing spinal cord cells on complete SMEAs with exposed metal electrodes. We report the fabrication of SMEAs, the culturing of dissociated spinal cord cells, and the results on plain silicone surfaces as well as on patterned SMEAs. This research is supported by NIH (NINDS R21 052794).
9:00 PM - M15.2
Strain Sensitivity in Polymers Implanted with Low-Energy Ions.
Giovanni DiGirolamo 1 , Ciro Esposito 1 , Marcello Massaro 1 , Emanuela Piscopiello 1 , Leander Tapfer 1 , Marco Vittori Antisari 2
1 Dept. Adv. Phys. Technol. and New Materials (FIM), ENEA, Brindisi Research Center , Brindisi Italy, 2 Dept. Adv. Phys. Technol. and New Materials (FIM), ENEA, Casaccia Research Center, Rome Italy
Show Abstract9:00 PM - M15.3
Flexible Amperometric Biosensors Using Plasma Fnctionalized Multiwall Carbon Nanotube-Polymer Composites.
Nam Ki Min 1 , Junyoung Lee 1 , Chul Jin Lee 1 , Kwang Ho Kwon 1
1 Biomicrosystem Technology, Korea University, Seoul Korea (the Republic of)
Show Abstract9:00 PM - M15.4
Internal Bubble Shapes Effect on Dielectric Behaviors in PVDF Films.
Ditthapun Suwansumpan 1 , Hathaikarn Manuspiya 1 , Bhalla Amar S. 2
1 petroleum and petrochemical college, chulalongkorn university, Bangkok Thailand, 2 Materials Research Institute , The Pennsylvania State University, Pennsylvania State, Pennsylvania, United States
Show Abstract