Chairs

M.F. Iskander J.O. Kiggans, Jr.
University of Utah Oak Ridge National Laboratory

J. Ch. Bolomey
Supélec

Endorsed by

American Ceramics Society
International Microwave Power Institute

Symposium Support

Ceramic Technology Project,
DOE Office of Transportation Technologies
Cober Electronics, Inc.
DOE, Advanced Industrial Concepts Program
Electricité de France (EDF)
Hewlett-Packard Company
Microwave Materials Technology
Varian Associates

*Invited Paper

SESSION O1: SCALE-UP AND COMMERCIALIZATION I
Chair: J.O. Kiggans Jr.
Monday Morning, April 8
Pacific H - 4th floor

8:30 A.M. O1.1
EVALUATION OF THE POTENTIAL MARKET OF DIELECTRIC HEATING APPLICATIONS, Marie-Cecile Miquel, Electricité France (EDF), Systems Energetiques, Moret-sur-Loing, France.

8:45 A.M. O1.2
SCALEUP OF THE NITRIDATION AND SINTERING OF SILICON PREFORMS USING MICROWAVE HEATING, J.O. Kiggans Jr., T.N. Tiegs, C.C. Davisson, Oak Ridge National Laboratory, Oak Ridge, TN; M.S. Morrow, Oak Ridge National Laboratory, Y-12 Development Division, Oak Ridge, TN; and G.J. Garvey, Golden Technologies, Inc., Golden, CO.

9:00 A.M. O1.3
MICROWAVE FIRING AT 86/915 MHZ - EFFICIENCY AND IMPLICATIONS, Michael Gower Hamlyn and Nigel Gareth Evans, Staffordshire University, School of Engineering, Stafford, United Kingdom.

9:15 A.M. O1.4
MICROWAVE SINTERING OF BIG-SIZE PRODUCTS, S. Tasaburo, Fuji Dempa Kogyo Company, Ltd., Ibaragi, Japan.

9:30 A.M. O1.5
INDUSTRIAL APPLICATIONS OF VARIABLE FREQUENCY MICROWAVE ENERGY IN MATERIALS PROCESSING, Zak Fathi, Denise A. Tucker, Wayne A. Lewis and J. Billy Wei, Lambda Technologies, Inc., Raleigh, NC.

9:45 A.M. BREAK

SESSION O2: MICROWAVE NONDESTRUCTIVE TESTING
Chair: J. Ch. Bolomey

10:15 A.M. O2.1
SOME ASPECTS RELATED TO THE TRANSFER OF MICROWAVE SENSING TECHNOLOGIES, Jean-Charles Bolomey, Université Paris, Supélec, Gif-sur-Yvette, France.

10:30 A.M. O2.2
USE OF MICROWAVES FOR NONDESTRUCTIVE MATERIAL INSPECTION, Brad Hokkanen and Jefferson Lindsey, Southern Illinois University, Technology Department, Carbondale, IL.

10:45 A.M. O2.3
MONITORING THE SHEET RESISTANCE OF METALLIC THIN FILMS AT MICROWAVE FREQUENCIES, Ray King and Michael Werner, KDC Technology Corporation, Livermore, CA.

11:00 A.M. O2.4
MATERIALS CHARACTERIZATION AND DIAGNOSIS USING VARIABLE FREQUENCY MICROWAVES, J. Billy Wei, Zak Fathi, Denise A. Tucker and Richard S. Garard, Lambda Technologies, Inc., Raleigh, NC.
11:15 A.M. O2.5
MICROWAVE SEPARATION MEASUREMENTS OF BULK LIFETIME AND SURFACE RECOMBINATION VELOCITIES IN Si WAFERS WITH VARIOUS SURFACE PROPERTIES, Y. Ogita, M. Minegishi, H. Higuma, Kanagawa Institute of Technology, Department of Electrical and Electronic Engineering, Kanagawa, Japan; M. Shigeto and K. Yakushiji, Showa Denko K.K., Silicon R&D Center, Saitama, Japan.

11:30 A.M. O2.6
A NEW 915 MHZ LOW POWER GENERATOR FOR MATERIALS TESTING UTILIZING AN EVANESCENT MODE CAVITY, Charles R. Buffler and Per O. Risman, Microwave Research Center, Eagan, MN.

11:45 A.M. O2.7
MICROWAVE SKIN EFFECT IN NONCONTACT PHOTOCONDUCTIVITY DECAY MEASUREMENTS IN Si WAFERS, Y. Ogita and S. Takahashi, Kanagawa Institute of Technology, Department of Electrical and Electronic Engineering, Kanagawa, Japan.


SESSION O3: MICROWAVE PROCESSING I
Chairs: P. Angelini and Z. Fathi
Monday Afternoon, April 8
Pacific H - 4th floor

1:30 P.M. O3.1
MICROWAVE PROCESSING OF COMPOSITIONALLY CHANGING CERAMIC SYSTEMS, Daniel Skamser, University of New Mexico, Department of Chemical and Nuclear Engineering, Albuquerque, NM; D. Lynn Johnson, Hamlin Jennings, Northwestern University, Department of Materials Science and Engineering, Evanston, IL; and Jeffrey Thomas, Northwestern University, Department of Civil Engineering, Evanston, IL.

1:45 P.M. O3.2
MICROWAVE CONTINUOUS PROCESSING OF ALUMINA ABRASIVE GRAINS, J. Cheng, Y. Fang, D.K. Agrawal, R. Roy, The Pennsylvania State University, Intercollege Materials Research Laboratory, University Park, PA; and P.S. Jayan, Carborundum Universal Ltd., Electro Minerals Division, Kochi, India.

2:00 P.M. O3.3
COMPARATIVE STUDIES OF MICROWAVE SINTERING OF ZINC OXIDE CERAMIC AT FREQUENCIES OF 2.45, 30 AND 84 GHz, Yu.V. Bykov, A.G. Eremeev, V.V. Holoptsev, V.E. Semenov, Institute of Applied Physics, Nizhni Novgorod, Russia; A. Birman, J. Calame, Y. Carmel, D. Gershon, B. Levush, University of Maryland, Institute of Plasma Research, College Park, MD; D. Dadon, P. Martin, M. Rosen,The Johns Hopkins University, Department of Materials Science and Engineering, Baltimore. MD; and R. Hutcheon, Chalk River Laboratories, Chalk River, Canada.

2:15 P.M. O3.4
MICROWAVE PROCESSING OF REDOX CERAMIC-METAL COMPOSITES, R.R. Di Fiore and D.E. Clark, University of Florida, Department of Materials Science and Engineering, Gainesville, FL.

2:30 P.M. O3.5
MICROWAVE PROCESSING OF VARIOUS CERAMIC MATERIALS, Y. Fang, J. Cheng, D.K. Agrawal, R. Roy and D.M. Roy, Pennsylvania State University, Intercollege Materials Research Laboratory, University Park, PA.

2:45 P.M. O3.6
MICROWAVE PROCESSING APPLIED TO CERAMIC REACTIONS, Mario González, Idalia Gómez and Juan Aguilar, UANL-FIME, San Nicolás de los Garza, Mexico.

3:00 P.M. O3.7
MICROWAVE INDUCED PLASMA (MIP) BRAZING OF SILICON NITRIDE TO STAINLESS STEEL, M. Samandi, M. Bate, C. Montross, R. Donnan, University of Wollongong, Department of Materials Engineering, Wollongong, Australia; and S. Miyake, University of Osaka, Japan Welding Research Institute, Ibaraki, Japan.

3:15 P.M. BREAK

SESSION O4: MICROWAVE SYSTEM DESIGN
Chair: H.D. Kimrey

3:45 P.M. O4.1
MICROWAVE APPLICATOR FOR CVD OF CONTINUOUS SILICON CARBIDE MONOFILAMENTS, Hal D. Kimrey, Microwave Materials Technologies, Inc., Knoxville, TN; and Richard C. Krutenat, Textron Specialty Materials, Lowell, MA.

4:00 P.M. O4.2
MICROWAVE FIELD VISUALIZATION, DIAGNOSTICS, AND PROCESSING APPLIED TO MATERIAL LOADED CAVITIES, J. Asmussen, M. Siegel and B. Wright, Michigan State University, Department of Electrical Engineering, East Lansing, MI.

4:15 P.M. O4.3
SINTERING CERAMICS: A NEW METHOD OF DESIGN FOR A MICROWAVE FIELD WITH HIGH POWER DENSITY AND UNIFORMITY, Jinsong Zhang, Xuexun Shen, Lihua Cao, Yongjing Yang and Fei Xia, Institute of Metal Research, Academia Sinica, Shenyang, China.

4:30 P.M. O4.4
APPLICATION OF RIDGED WAVEGUIDE IN MICROWAVE SINTERING, Zhou Jian, Cheng Jiping, Liu Xianjun, Tang Yuling and Wan Zhangguo, Wuhan University of Technology, Advanced Material Research Institute, Wuhan, China.

4:45 P.M. O4.5
THE USE OF MICROWAVE-ASSISTED PROCESSING FOR THE PRODUCTION OF HIGH Tc SUPERCONDUCTORS, A.T. Rowley and R. Wroe, EA Technology, Chester, United Kingdom.

5:00 P.M. O4.6
THE DESIGN AND EXCITATION OF AN ELLIPTICAL MICROWAVE CAVITY PROCESSING REACTOR, Ziming He, Mark Prelas, Jon Meese and Le-de Lin, University of Missouri-Columbia, Columbia, MO.

SESSION O5: DIELECTRIC PROPERTIES I
Chairs: R. Bruce and S. Bringhurst
Tuesday Morning, April 9
Pacific H - 4th floor

8:30 A.M. O5.1
DIELECTRIC PROPERTIES MEASUREMENT TECHNIQUES, David Blackham, Hewlett-Packard Company, Santa Rosa, CA.

8:45 A.M. O5.2
MEASUREMENT OF DIELECTRIC PROPERTIES FOR INTENSE HEATING APPLICATIONS, Jose M. Borrego and Kenneth A. Connor, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Science Engineering, Troy, NY.

9:00 A.M. O5.3
FDTD SIMULATIONS FOR COAXIAL PROBE THIN SAMPLE MEASUREMENT AND ANALYSIS, Shane Bringhurst and Magdy F. Iskander, University of Utah, Department of Electrical Engineering, Salt Lake City, UT.

9:15 A.M. O5.4
DIELECTRIC MEASUREMENT OF MULTI-LAYERED MEDIA USING AN OPEN-ENDED WAVEGUIDE, Oliver Tantot and Michel Chatard-Moulin, Université de Limoges, IRCOM, Limoges, France.

9:30 A.M. O5.5
A NEW APPROACH FOR DIELECTRIC MEASUREMENTS AT HIGH TEMPERATURES, C.B.G. Groffils, P.J. Luypaert, MEAC, Heverlee, Belgium; Zhou Yan and O. Van Der Biest, Department MTM, Heverlee, Belgium.

9:45 A.M. O5.6
COMPLEX PERMEABILITY MEASUREMENTS OF MICROWAVE FERRITES, Richard G. Geyer, National Institute of Standards and Technology, Electromagnetic Fields Division, Boulder, CO; and Jerzy Krupka, Instytut Mikroelektroniki i Optoelektroniki Politechniki Warszawskiej, Warszawa, Poland.

10:00 A.M. O5.7
IN-LINE MEASUREMENT OF HIGH TEMPERATURE DIELECTRIC CONSTANT IN THE PROCESS OF MICROWAVE SINTERING, Zhou Jian, Cheng Jiping, Pan Jin, Tang Yuling and Qiu Jinyu, Wuhan University of Technology, Advanced Material Research Institute, Wuhan, China.

10:15 A.M. BREAK

SESSION O6: MODELING OF MICROWAVE HEATING I
Chairs: J.M. Tranquilla and B. Maestrali

10:45 A.M. O6.1
AN OVERVIEW OF ELECTROMAGNETIC MODELLING OF SINGLE- AND MULTI-MODE APPLICATORS AT EMR MICROWAVE TECHNOLOGY CORPORATION, J.M. Tranquilla, H. Al-Rizzo and K. Clark, EMR Microwave Technology Corporation, Fredericton, Canada.

11:00 A.M. O6.2
TRIFOU: A 3D SOFTWARE FOR SOLVING MICROWAVE PROBLEMS, Pierre Chaussecourte and Bernard Maestrali, Electricité of France, Clamart, France.

11:15 A.M. O6.3
HYBRID NUMERICAL METHODS FOR MODELING MICROWAVE SINTERING EXPERIMENTS, Cheryl Hile and Gregory A. Kriegsmann, New Jersey Institute of Technology, Department of Mathematics, Newark, NJ.

11:30 A.M. O6.4
DEVELOPMENT OF A MULTI-GRID FDTD CODE FOR THREE DIMENSIONAL APPLICATIONS, Mikel J White, Magdy F. Iskander, Zhenlong Huang, University of Utah, Department of Electrical Engineering, Salt Lake City, UT; and Hal D. Kimrey, Oak Ridge National Laboratory, Oak Ridge, TN.

11:45 A.M. O6.5
COMPARISON OF FINITE-DIFFERENCE AND ANALYTIC MICROWAVE CALCULATION METHODS, F. Friedlander, CPI Microwave Power Tube Products, Palo Alto, CA; H.W. Jackson, M. Barmatz and P. Wagner, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA.

SESSION O7: MICROWAVE PROCESSING II
Chair: D.A. Lewis
Tuesday Afternoon, April 9
Pacific H - 4th floor

1:30 P.M. O7.1
MICROWAVE PROCESSING OF THIN SHEET MATERIALS, David A. Lewis, Stanley J. Whitehair, Alfred Viehbeck, Jane M. Shaw, IBM T.J. Watson Research Center, Yorktown Heights, NY.

1:45 P.M. O7.2
MICROWAVE MELTING OF ION-CONDUCTING GLASSES, David Duval and Subhash H. Risbud, University of California, Division of Materials Science and Engineering, Davis, CA.

2:00 P.M. O7.3
MICROWAVE PROCESSING CaO-Al2O3-SiO2 GLASS USING SOL-GOL TECHNIQUE, Y. Zhou and O. Van der Biest, Katholieke University Leuven, Department of Metallurgy and Materials Engineering, Heverlee, Belgium.

2:15 P.M. O7.4
MICROWAVE SINTERING OF PURE AND DOPED NANOCRYSTALLINE ALUMINA COMPACTS, R.W. Bruce, A.W. Fliflet, Naval Research Laboratory, Plasma Physics Division, Washington, DC; D. Lewis III, R. Rayne, B. Bender, Naval Research Laboratory, Material Science and Technology Division, Washington, DC; L.K. Kurihara, G.-M. Chow and P.E. Schoen, Naval Research Laboratory, Center for Molecular Science and Engineering, Washington, DC.

2:30 P.M. O7.5
MICROWAVE SINTERING CHARACTERISTICS OF SHS-PREPARED ß-SIALON POWDERS, J. Cai, G.F. Xu, H.R. Zhuang, W.L. Li and J.K. Guo, Shanghai Institute of Ceramics, High-Temperature Structural Ceramics, Shanghai, China; and Y.L. Tian, George Mason University, Electrical Engineering and Computer Sciences Department, Fairfax, VA.

2:45 P.M. O7.6
PREPARATION OF YBCO PLATELETS AND FILMS BY MOD AND MICROWAVE HEATING, C. Manfredotti, P. Volpe and M. Castiglioni, University of Torino, Italy, and National Institute for Matter Physics, Torino, Italy.

3:00 P.M. O7.7
NOVEL MICROSTRUCTURES IN MICROWAVE SINTERED SILICON NITRIDE, Manuel E. Brito, Kiyoshi Hirao, Motohiro Toriyama, National Industrial Research, Institute of Nagoya, Nagoya, Japan; and Masayuki Hirota, Advanced Technology Research NEDO, Tokyo, Japan.

3:15 P.M. O7.8
A COMPARISON OF MM-WAVE SINTERING AND FAST CONVENTIONAL SINTERING OF NANOCRYSTALLINE Al2O3, G. Link, Forschungszentrum Karlsruhe, ITP, Karlsruhe, Germany; V. Ivanov, S. Paranin, V. Khrustov, Institute of Electrophysics, Ekaterinburg, Russia; R. Böhme, Forschungszentrum Karlsruhe, INR, Karlsruhe, Germany; G. Müller, University Stuttgart, IPF, Stuttgart, Germany; G. Schumacher, Forschungszentrum Karlsruhe, INR, Karlsruhe, Germany; M. Thumm, Forschungszentrum Karlsruhe, ITP, Karlsruhe, Germany and University Karlsruhe, IHE, Karlsruhe, Germany; and A. Weisenburger, Forschungszentrum Karlsruhe, INR, Karlsruhe, Germany.

3:30 P.M. BREAK

SESSION O8: MICROWAVE INTERACTIONS AND MECHANISMS I
Chairs: Y. Bykov and J. Booske

4:00 P.M. O8.1
INFLUENCE OF SPECIFIC ABSORBED MICROWAVE POWER ON ACTIVATION ENERGY OF DENSIFICATION IN CERAMIC MATERIALS, Y. Bykov, A. Eremeev and V. Holoptsev, Russian Academy of Sciences, Institute of Applied Physics, Nizhny Novgorod, Russia.

4:15 P.M. O8.2
KINETICS OF THE CARBON MONOXIDE OXIDATION REACTION UNDER MICROWAVE HEATING, William Perry, Joel D. Katz, Daniel E. Rees, Los Alamos National Laboratory, Department of Materials Science Technology, Los Alamos, NM; and Abhaya Datye, University of New Mexico, Department of Chemical and Nuclear Engineering, Albuquerque, NM.
4:30 P.M. O8.3
INFLUENCE OF MICROWAVE TREATMENT ON NEAR-CONTACT AND BULK PROPERTIES OF TECHNICALLY URGENT SEMICONDUCTORS, A.A. Belyaev, A.E. Belyaev, R.V. Konakova, S.M. Komirenko, V.G. Lyapin, V.V. Milenin, Yu. A. Tkhorik, Academy of Science of Ukraine, Institute of Semiconductor Physics, Kiev, Ukraine; and M.V. Shevelev, Academy of Science of Ukraine, E.O. Paton Electric Welding Institute, Kiev, Ukraine.

4:45 P.M. O8.4
MICROWAVE RADIATION ABSORPTION IN DIELECTRIC IONIC CRYSTALS DUE TO POINT AND EXTENDED DEFECTS, B.D. Klein, J.H. Booske, R.F. Cooper and S.A. Freeman, University of Wisconsin, Department of Electrical Engineering, Madison, WI.

SESSION O9: MICROWAVE PROCESSING USING
VARIABLE FREQUENCY SOURCES
Chairs: A.D. McMillan and M. White
Wednesday Morning, April 10
Pacific H - 4th floor

8:30 A.M. O9.1
SPREAD SPECTRUM MICROWAVE POWER GENERATION FOR IMPROVING EFFICIENCIES, W. Van Loock, University of Ghent, Information Technology Department, Ghent, Belguim.

8:45 A.M. O9.2
PROCESSING THERMOSETTING PREPREG LAMINATES BY VARIABLE FREQUENCY MICROWAVE HEATING, April D. McMillan and Felix L. Paulauskas, Oak Ridge National Laboratory, Oak Ridge, TN.

9:00 A.M. O9.3
FDTD SIMULATION OF VARIABLE FREQUENCIES IN A LARGE MULTIMODE CAVITY USED FOR MICROWAVE SINTERING, Steven F. Dillon, Mikel J White, Magdy F. Iskander and Shane Bringhurst, University of Utah, Department of Electrical Engineering, Salt Lake City, UT.

9:15 A.M. O9.4
ADHESIVE BONDING VIA EXPOSURE TO VARIABLE FREQUENCY MICROWAVE RADIATION, Felix L. Paulauskas, April D. McMillan and C. David Warren, Oak Ridge National Laboratory, Oak Ridge, TN.

9:30 A.M. O9.5
ELECTROMAGNETICALLY DRIVEN HEAT WAVE IN ZINC OXIDE, L.P. Martin, The Johns Hopkins University, Baltimore, MD; D. Dadon, N.R.C.N., Beer Sheva, Israel; D. Gershon, A. Birman, University of Maryland, Energy Research Building, College Park, MD; R. Hutcheon, Chalk River Laboratories, Chalk River, Canada; J.P. Calame, Y. Carmel, University of Maryland, Energy Research Building, College Park, MD; and M. Rosen, The Johns Hopkins University, Baltimore, MD.

9:45 A.M. O9.6
MICROWAVE PROCESS CONTROL THROUGH A TRAVELING WAVE TUBE SOURCE, G.J. Vogt, A. Regan, A. Rohlev and M. Curtin, Los Alamos National Laboratory, Los Alamos, NM.

10:00 A.M. BREAK

SESSION O10: SCALE-UP AND COMMERCIALIZATION II
Chair: R.J. Lauf

10:30 A.M. O10.1
KILN DESIGN FOR UNIFORMITY IN MICROWAVE PROCESSING OF CERAMICS, Michael Gower Hamlyn, Nigel Gareth Evans and Alan L. Bowden, Staffordshire University, School of Engineering, Stafford, United Kingdom.

10:45 A.M. O10.2
FDTD SIMULATION OF MICROWAVE SINTERING IN LARGE (500/4000 LITER) MULTIMODE CAVITIES, Marta Subirats, Yinghui Yao, Magdy F. Iskander, University of Utah, Salt Lake City, UT; and Jim Kiggans, Oak Ridge National Laboratory, Oak Ridge, TN.

11:00 A.M. O10.3
ELECTRICAL TOMOGRAPHY SYSTEMS, SENSOR SELECTION AND APPLICATIONS TO INDUSTRIAL PROCESS IMAGING, Roger C. Waterfall and Maurice S. Beck, UMIST, Electrical Engineering and Electronics Department, Manchester, United Kingdom.

11:15 A.M. O10.4
APPLICATION OF THE 50 [[Omega]] RADIO FREQUENCY TECHNOLOGY IN THE AUTOMOTIVE INDUSTRY: FAST BONDING OF COMPOSITE MATERIALS: REAR DOORS OF THE CITROEN ZX AND CITROEN XANTIA CARS, J.P. Bernard, SAIREM, Vaulx-en-Velin, France; and Sabran, Manducher, Oyonnax, France.

11:30 A.M. O10.5
WINDOW ENCAPSULATION IN THE CAR INDUSTRY BY USING THE 50 [[Omega]] RF TECHNOLOGY, J.P. Bernard, SAIREM, Vaulx-en-Velin, France; and Barboteau, Webasto Heuliez, Les Chatelliers Chateaumur, France.

11:45 A.M. O10.6
MICROWAVE SINTERING OF TUNGSTEN CARBIDE COBALT CERMETS, T. Gerdes, M. Willert-Porada, Universität Dortmund, Dortmund, Germany; and K. Rödiger, Widia GmbH, Essen, Germany.

SESSION O11: ALTERNATIVE MICROWAVE SOURCES
Chair: D.W. Bible
Wednesday Afternoon, April 10
Pacific H - 4th floor

1:30 P.M. O11.1
MILLIMETER WAVE MATERIAL SEPARATION SYSTEM, S. Birken, K. Birken, Energy Separation Systems, Clifton Park, NY; K. Connors, Rensselaer Polytechnic Institute, Troy, NY; and G. Scheitrum, Litton Systems EDD, San Carlos, CA.

1:45 P.M. O11.2
PULSED 35 GHz GYROTRON WITH OVERMODED APPLICATOR FOR SINTERING EXPERIMENTS, A.W. Fliflet, R.P. Fischer, A.K. Kinkead and R.W. Bruce, Naval Research Laboratory, Plasma Physics Division, Washington, DC.

2:00 P.M. O11.3
ADVANCED CERAMICS SINTERING USING HIGH-POWER MILLIMETER-WAVE RADIATION, Y. Setsuhara, M. Kamai, S. Kinoshita, N. Abe, S. Miyake, Osaka University, Japan Welding Research Institute, Ibaraki, Japan; and T. Saji, Fujidempa Kogyo Company, Ltd., Ibaraki, Japan.

SESSION O12: REMEDIATION OF HAZARDOUS WASTE
Chairs: S.J. Oda and T. White

2:15 P.M. O12.1
PROCESSING HAZARDOUS WASTE WITH DIELECTRIC HEATING, Steven J. Oda, Etobicoke, Canada.

2:30 P.M. O12.2
MICROWAVE VITRIFICATION SYSTEMS FOR RADIOACTIVE WASTE, Terry Lee White, Oak Ridge National Laboratory, Fusion Energy Division, Oak Ridge, TN; and William D. Bostick, Oak Ridge K-25 Site, Technical Division, Oak Ridge, TN.

2:45 P.M. O12.3
MICROWAVE TREATMENT OF EMISSIONS FROM WASTE MATERIALS, R.L. Schulz, D.C. Folz, D.E. Clark, University of Florida, Department of Materials Science and Engineering, Gainesville, FL; C.J. Schmidt, University of Florida, Department of Environmental Engineering, Gainesville, FL; and G.G. Wicks, Westinghouse Savannah River Technology Center, Aiken, SC.

3:00 P.M. O12.4
MICROWAVE-ENHANCED CATALYTIC REFORMING OF METHANE WITH CARBON DIOXIDE, V.I. Fedoseev, Yu.Yu. Tamashev, V.V. Pushkarev and Yuri I. Aristov, Boreskov Institute of Catalysis, Novosibirsk, Russia.

3:15 P.M. BREAK

SESSION O13: TEMPERATURE MODELING
AND MEASUREMENTS
Chair: H.W. Jackson

3:45 P.M. O13.1
APPLICATION OF MULTIWAVELENGTH PYROMETRY IN MICROWAVE PROCESSING OF MATERIALS, R.S. Donnan and M. Samandi, University of Wollongong, Department of Materials Engineering, Wollongong, Australia.

4:00 P.M. O13.2
TEMPERATURE DISTRIBUTION IN A FLOWING FLUID HEATED IN A MICROWAVE RESONANT CAVITY, James R. Thomas, Virginia Tech, Department of Mechanical Engineering, Blacksburg, VA; Robert J. Kares, Ray M. Stringfield and Eric M. Nelson, Los Alamos National Laboratory, Los Alamos, NM.

4:15 P.M. O13.3
TRANSIENT TEMPERATURE DISTRIBUTIONS IN A CYLINDER HEATED BY MICROWAVES, H.W. Jackson, M. Barmatz and P. Wagner, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA.

4:30 P.M. O13.4
TEMPERATURE GRADIENTS AND RESIDUAL POROSITY IN MICROWAVE SINTERED ZINC OXIDE, L.P. Martin, The John Hopkins University, Baltimore, MD; D. Dadon, N.R.C.N., Beer Sheva, Israel; D. Gershon, A. Birman, J.P. Calame, B. Levush, Y. Carmel, University of Maryland, Energy Research Building, College Park, MD; and M. Rosen, The Johns Hopkins University, Baltimore, MD.

SESSION O14: MICROWAVE PROCESSING OF POLYMERS
Chair: A. Gourdenne
Thursday Morning, April 11
Pacific H - 4th floor
8:30 A.M. O14.1
MICROWAVE AND MILLIMETER WAVE PROCESSING OF POLYMER-DERIVED SILICON NITRIDE CERAMICS AND COMPOSITES, S.T. Schwab, M.D. Grimes, R.C. Graef, Southwest Research Institute, San Antonio, TX; J.D. Katz, Los Alamos National Laboratory, Los Alamos, NM; and D.E. Rees, Los Alamos National Laboratory, Los Alamos, NM.

8:45 A.M. O14.2
MICROWAVE PROCESS CONTROL FOR POLYMER CURING WITH DIELECTRIC PROPERTY MEASUREMENTS IN A BROAD FREQUENCY RANGE, 1 MHz-10 GHz, O. Meyer, N. Belhadj-Tahar and A. Fourrier-Lamer, UPMC, LDIM, Paris, France.

9:00 A.M. O14.3
HIGH FREQUENCY (27.12 MHz) ACTIVATION OF THE RADICAL CURING OF UNSATURATED POLYESTERS IN STYRENE SOLUTION, Patrick Alazard and Albert Gourdenne, Ecole Nationale Supérieure de Chimie, Laboratoire des Matériaux, Toulouse, France.

9:15 A.M. O14.4
MONITORING RESIN CURE OF MEDIUM DENSITY FIBERBOARD USING DIELECTRIC SENSORS, Ray King, KDC Technology Corporation, Livermore, CA; and Robert Rice, University of Maine, Wood Science and Technology Department, Orono, MA.

9:30 A.M. O14.5
MECHANICAL BEHAVIOUR OF MICROWAVE PROCESSED POLYMER MATRIX COMPOSITES: THE EFFECT OF THE TEMPERATURE INCREASE RATE, M. Delmotte, J. Fitoussi, C. Moré and H. Jullien, Laboratoire Microstructures et Mécanique des Matériaux, CNRS, Paris, France.

9:45 A.M. O14.6
MICROWAVE CHARACTERIZATION OF CONDUCTIVE POLYMERS, Yonghong Hua, Cevdet Akyel, Ecole Polytechnique de Montréal, Department of Electrical and Computer Engineering, Montréal, Canada.

10:00 A.M. O14.7
COMPARATIVE STUDY OF Si3N4-BASED CERAMICS SINTERING AT FREQUENCIES 30 AND 83 GHz, Y.Bykov, A. Eremeev and V. Holoptsev, Russian Academy of Sciences, Institute of Applied Physics, Nizhny Novgorod, Russia.

10:15 A.M. BREAK

SESSION O15: MICROWAVE PROCESSING III
Chair: M. Delmotte

10:45 A.M. O15.1
SPANISH ACTIVITIES (RESEARCH AND INDUSTRIAL APPLICATIONS) IN THE FIELD OF MICROWAVE MATERIAL TREATMENT, Elias de los Reyes Davó, E.T.S.I. Telecomunicación, Universidad Politécnica de Valencia, Valencia, Spain.

11:00 A.M. O15.2
PROCESSING AND CHARACTERISATION OF MICROWAVE AND CONVENTIONALLY SINTERED BULK YBCO HIGH-Tc SUPERCONDUCTORS, I.A.H. Al-Dawery, J.G.P. Binner, University of Nottingham, Department of Materials Engineering and Materials Design, Nottingham, United Kingdom; and T.E. Cross, University of Nottingham, Department of Electrical and Electronic Engineering, Nottingham, United Kingdom.

11:15 A.M. O15.3
MICROWAVE SINTERING AND TEXTURING OF HIGH Tc SUPERCONDUCTOR YBaCuO, A. Cherradi, G. Desgardin, J. Provost and B. Raveau, CRISMAT, ISMRA and Université de CAEN, Caen, France.

11:30 A.M. O15.4
SYNTHESIS AND PROCESSING OF POROUS TITANIUM OXIDE, P. Luo and T.G. Nieh, Lawrence Livermore National Laboratory, University of California, Livermore, CA.

11:45 A.M. O15.5
GROWTH AND STABILIZATION OF HOT SPOTS IN MICROWAVE HEATED CERAMIC FIBERS, Gregory A. Kriegsmann, New Jersey Institute of Technology, Department of Mathematics, Newark, NJ.

SESSION O16: MODELING OF MICROWAVE HEATING II
Chair: C. Buffler
Thursday Afternoon, April 11
Pacific H - 4th floor

1:30 P.M. O16.1
VALIDATION OF FDTD SIMULATION RESULTS USING EXPERIMENTAL RF DRYER, Mikel White, Shane Bringhurst and Magdy F. Iskander, University of Utah, Department of Electrical Engineering, Salt Lake City, UT.

1:45 P.M. O16.2
3-D TEMPERATURE DISTRIBUTIONS IN SPOT HEATING OF A CERAMIC BY A FOCUSED MICROWAVE SOURCE, R.M. Roos and James R. Thomas, Virginia Tech, Department of Mechanical Engineering, Blacksburg, VA.

2:00 P.M. O16.3
ENHANCED COMPUTER MODELLING FOR HIGH TEMPERATURE MICROWAVE PROCESSING OF CERAMIC MATERIALS, M.P. Craven, T.E. Cross, University of Nottingham, Department of Electrical Engineering, Nottingham, United Kingdom; and J.G.P. Binner, University of Nottingham, Department of Materials Engineering, Nottingham, United Kingdom.

2:15 P.M. O16.4
NUMERICAL SIMULATION OF RESONANT CAVITY MICROWAVES SYSTEMS FOR MATERIALS PROCESSING, Timothy A. Grotjohn and Jes Asmussen, Michigan State University, Department of Electrical Engineering, East Lansing, MI.

2:30 P.M. O16.5
THE MiRa/THESIS-CODE PACKAGE FOR RESONATOR DESIGN AND MODELLING OF MILLIMETERWAVE MATERIAL PROCESSING, L. Feher, G. Link, Forschungszentrum Karlsruhe, Technik und Umwelt Institut für Technische Physik-ITP, Karlsruhe, Germany; and M. Thumm, University Karlsruhe, Institut für Höchstfrequenztechnik und Elektronik, Karlsruhe, Germany.

2:45 P.M. O16.6
MICROWAVE-ASSISTED IGNITION, John Bechtold, Michael Booty and Gregory Kriegsmann, New Jersey Institute of Technology, Department of Mathematics, Newark, NJ.

3:00 P.M. BREAK

SESSION O17: MICROWAVE MEASUREMENTS
Chair: D. Rytting

3:30 P.M. O17.1
COMPONENT/DEVICE CHARACTERIZATION, Roger Pollard and Doug Rytting, Hewlett-Packard Company, Santa Rosa, CA.

3:45 P.M. O17.2
THE MAGNETIC FIELD SENSOR ON THE BASE OF YBaCuO CERAMICS WITH SHARP JUMP OF MAGNETIC REPLY, Kh. R. Rostami, A.A. Sukhanov and V.V. Mantorov, Institute of Radioengineering and Electronics, Department of Microelectronics, Moscow, Russia.

4:00 P.M. O17.3
A NEW METHOD OF THE ELECTROMAGNETIC FIELD'S DISTRIBUTION MEASURE IN MICROWAVE RESONANT CAVITY, Liu Xianjun, Zhou Jian, Cheng Jiping, Qiu Jinyu and Dong Xuebin, Wuhan University of Technology, Advanced Material Research Institute, Wuhan, China.

SESSION O18: PLASMA PROCESSING
Chair: D.L. Johnson

4:15 P.M. O18.1
MICROWAVE PLASMA SINTERING OF ALUMINA, Hunghai Su and D. Lynn Johnson, Northwestern University, Department of Materials Science and Engineering, Evanston, IL.

4:30 P.M. O18.2
MICROWAVE PLASMA ASSISTED DIAMOND COATING OF Ti AND Ti-6Al-4V, Denise A. Tucker, Zak Fathi, J. Billy Wei, Lambda Technologies, Inc., Raleigh, NC; Michael T. McClure, Zlatko Sitar, North Carolina State University, Raleigh, NC; Barbara Walden, Trinity College, Hartford, CT; and Willard H. Sutton, United Technologies Research Center, East Hartford, CT.

4:45 P.M. O18.3
MICROWAVE ANNEALING OF ION IMPLANTED 6H-SiC, Jason Gardner, Majari Rao and Yang Tian, George Mason University, Department of Electrical and Computer Engineering, Fairfax, VA.

SESSION O19: POSTER SESSION
Chairs: M.F. Iskander, J.O. Kiggans, and J.Ch. Bolomey
Thursday Evening, April 11
8:00 P.M.
Presidio Ballroom

O19.1 MICROWAVE HEATING OF CERAMIC COMPOSITE: A ONE-DIMENSIONAL MATHEMATICAL MODEL, John Pelesko and Gregory A. Kriegsmann, New Jersey Institute of Technology, Department of Mathematics, Newark, NJ.

O19.2 INSULATING/HYBRID HEATING SYSTEMS FOR MICROWAVE SINTERING EXPERIMENTS, R.W. Bruce, Sachs/Freeman Associates, Landover, MD; A.W. Fliflet, Naval Research Laboratory, Plasma Physics Division, Washington, DC; and A.K. Kinkead, Sachs/Freeman Associates, Landover, MD.

O19.3 DEPOSITION OF THIN SiO2 FILMS ON POLYMERS AS A HARDCOATING USING A MICROWAVE-ECR PLASMA, K. Sano, S. Hayashi, M. Nomura, SUZUKI Motor Corporation, Hamamatsu, Japan; S. Wickramanayaka, Y. Nakanishi and Y. Hatanaka, Research Institute of Electronics, Shizuoka University, Hamamatsu, Japan.

O19.4 FRACTURE STRENGTH STUDIES OF CONVENTIONALLY AND MICROWAVE-SINTERED Al2O3, D.J. Grellinger, K.R. Binger, University of Wisconsin, Department of Electrical Engineering, Madison, WI; R.F. Cooper, University of Wisconsin, Department of Materials Science and Engineering, Madison, WI; J.H. Booske and S.A. Freeman, University of Wisconsin, Department of Electrical Engineering, Madison, WI.

O19.5 NDT OF CERAMICS WITH MICROWAVES: MEASUREMENTS OF CRACKS AND RESIDUAL STRESS, Henning Dannheim, University Erlangen Werkstoffwiss III, Erlangen, Germany.

O19.6 NEW METHOD FOR DIMENSIONING DEFECTS IN MICROWAVES NDT, Abboud Boufeldja, University of Claude Bernard Lyon, Villeurbanne, France.

O19.7 ADHESIVE BONDING VIA EXPOSURE TO MICROWAVE RADIATION AND RESULTING MECHANICAL EVALUATION, Felix L. Paulauskas, Oak Ridge National Laboratory, Polymer Composite Technology, Oak Ridge, TN; Thomas J. Meek, University of Tennessee, Materials Science and Engineering Department, Knoxville, TN; and C. David Warren, Oak Ridge National Laboratory, Polymer Composite Technology, Oak Ridge, TN.

O19.8 FDTD SIMULATION OF INDUCTION HEATING OF CERAMIC WARE, Mikel White and Magdy F. Iskander, University of Utah, Department of Electrical Engineering, Salt Lake City, UT.

O19.9 STUDY OF MICROWAVE-DRIVEN CURRENTS IN IONIC CRYSTALS, V.E. Semenov, K.I. Rybakov, Russian Academy of Sciences, Institute of Applied Physics, Nizhny Novgorod, Russia; S.A. Freeman, J.H. Booske and R.F. Cooper, University of Wisconsin, Madison, WI.

O19.10 PROPERTIES OF GELCAST AND MICROWAVE SINTERED BORON CARBIDE, Marvin S. Morrow and Don E. Schechter, Lockheed Martin, Development Department, Oak Ridge, TN.

SESSION O20: MICROWAVE INTERACTIONS
AND MECHANISMS II
Chair: M. Willert-Porada
Friday Morning, April 12
Pacific H - 4th floor

8:30 A.M. O20.1
MICROWAVE EFFECTS ON SPINODAL DECOMPOSITION, M. Willert-Porada, Universität Dortmund, Dortmund, Germany.

8:45 A.M. O20.2
THERMAL PHENOMENA UNDER MICROWAVE FIELD IN THE ORGANIC SYNTHESIS PROCEEDINGS: APPLICATION TO THE DIELS ALDER REACTION, Raphaëlle Saillard, Martine Poux, ENSIGC, Toulouse, France; and Michèle Audhuy-Peaudecert, ENSEEIHT, Toulouse, France.

9:00 A.M. O20.3
HIGH-FREQUENCY FIELD EFFECTS ON SOLID-STATE DIFFUSION, S.A. Freeman, J.H. Booske, University of Wisconsin, Department of Electrical and Computer Engineering, Madison, WI; R.F. Cooper, University of Wisconsin, Department of Materials Science and Engineering, Madison, WI.

9:15 A.M. O20.4
KINETICS OF REDUCTION OF IRON OXIDES USING MICROWAVES AS POWER SOURCE, Idalia Gómez, Juan Aguilar and Javier Morales, UANL-FIME, San Nicolás de los Garza, Mexico.

9:30 A.M. O20.5
MODIFICATIONS ON BULK CRYSTALLIZATION OF GLASSES BELONGING TO M2O-CaO-SiO2-ZrO2 SYSTEM IN A 2.45 GHZ MICROWAVE FIELD, Cristina Leonelli, Cristina Siligardi, University of Modena, Department of Chemistry, Modena, Italy; Yi Fang and Dinesh Agrawal, Pennsylvania State University, Intercollege Materials Research Laboratory, University Park, PA.

9:45 A.M. O20.6
POSSIBILITY OF MICROWAVE-CONTROLLED SURFACE MODIFICATION, K.I. Rybakov, Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD; and V.E. Semenov, Institute of Applied Physics, Nizhny Novgorod, Russia.
10:00 A.M. O20.7
GRAIN GROWTH BEHAVIOR DURING MICROWAVE SINTERING OF SILICON NITRIDE, Masayuki Hirota, Advanced Technology Research NEDO, Tokyo, Japan; Manuel E. Brito, Kiyoshi Hirao, Koji Watari and Motohiro Toriyama, National Industrial Research Institute of Nagoya, Nagoya, Japan.

10:15 A.M. O20.8
KINETICS AND MECHANISM OF THE MICROWAVE SYNTHESIS OF BARIUM TITANATE, Hanlin Zhang, Shixi Ouyang, Hanxing Liu and Yongwei Li, Wuhan University of Technology, National Key Laboratory, Wuhan, China.

10:30 A.M. BREAK
SESSION O21: DIELECTRIC PROPERTIES II
Chair: D. Blackham

11:00 A.M. O21.1
CHARACTERIZATION OF THIN SEMICONDUCTOR FILMS FOR (OPTO)ELECTRONIC APPLICATIONS, J.R. Elmiger, H. Feist and M. Kunst, Hahn-Meitner-Institut, Department Solare Energetik, Berlin, Germany.

11:15 A.M. O21.2
DIELECTRIC PROPERTIES OF POROUS ZINC OXIDE CERAMICS, J.P. Calame, Y. Carmel, D. Gershon, A. Birman, University of Maryland, Institute of Plasma Research, College Park, MD; L.P. Martin, D. Dadon, M. Rosen, John Hopkins University, Department of Materials Science and Engineering, Baltimore, MD; and R. Hutcheon, Chalk River Laboratories, Chalk River, Canada.

11:30 A.M. O21.3
DIELECTRIC PERMITTIVITY AND AC CONDUCTIVITY OF POLYSTYRENE THIN FILMS WITH DISPERSED TGS POWDER AT 1 MHZ-1.3 GHZ, Calvin W. Lowe, S.C. Mathur and M. Rachedine, Hampton University, Department of Electrical Engineering, Hampton, VA.

11:45 A.M. O21.4
MICROWAVE DIELECTRIC PROPERTIES, THERMAL ANALYSIS AND CHEMICAL COMPOSITION OF HEAVY CLAY BODIES, Garth Tayler, Acme Brick Company, Technical Department, Fort Worth TX; Michael G. Hamlyn, Staffordshire University, School of Engineering, Stafford, United Kingdom; and Michael Anderson, Staffordshire University, School of Design and Ceramics, Stoke on Trent, United Kingdom.

12:00 NOON O21.5
MEASUREMENT OF THE DIELECTRIC PROPERIES OF POLYSTYRENE PARTICLES IN ELECTROLYTE SOLUTION, Constantino Grosse and Mónica Cecilia Tirado, Universidad Nacional de Tucumán, Instituto de Fisica, San Miguel de Tucumán, Argentina.

12:15 P.M. O21.6
IN SITU DIELECTRIC MEASUREMENTS OF ZINC OXIDE IN CONVENTIONAL AND MICROWAVE FURNACES, David L. Gershon, University of Maryland at College Park, Department of Physics, College Park, MD; Yuval Carmel, University of Maryland at College Park, Department of Electrical Engineering, College Park, MD; M. Rosen, Peter Martin, Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD; and Jeff Calame, University of Maryland at College Park, Department of Electrical Engineering, College Park, MD.


The following exhibitors have identified their products and services as directly related to your research:

Academic Press
AJA International
American Institute of Physics
ASTeX/Applied Science & Technology, Inc.
Axic, Inc.
Commonwealth Scientific Corp.
Continental Electronics Corp.
Elsevier Science, Inc.
IOP Publishing, Inc.
Kluwer Academic Publishers
Lambda Technologies, Inc.
LUXTRON Corporation
Philips Semiconductors/Materials Analysis Group

See page 6 for a complete list of exhibitors.