2018 MRS Fall Meeting Home

Symposium PM02—Conductive Materials Reliability in Flexible Electronics

Advances in flexible conductive materials offer the potential to integrate complex electronics for wearable systems that can enable applications in health and fitness monitoring. Differences between textile and thin film form factors that are being developed each necessitate the need for new materials understanding. Specifically, challenges in manufacturing integration strategies and evaluations of flexible electronics materials must be overcome to enable the production of durable integrated systems. This symposium aims to provide a forum for collaborative, multidisciplinary discussion on the progress, views, and future directions in three main themes: (1) process-property relationships of flexible electronic systems, (2) standardized methods in flexible electronic systems evaluation, and (3) flexible device designs. Conductive inks (low-to-high viscosity), including their integration into textiles, will be a major focus as will their ability to integrate numerous sensor, energy harvesting and storage devices that are conductive to flexible applications including smart wearables and monitoring devices (i.e. second skin). Finally, each thrust area will identify industrial research needs that meets the needs of scaling product development from the lab to market.

Topics will include:

  • Processing Strategies
  • Printing, Vapor Deposition, and Chemical Deposition
  • Conductive Printing on Non-Planar Surfaces
  • Conductive Textiles, Fibers, and Inks
  • Post Deposition Treatment
  • Self-healing/Autonomically Repairing Inks
  • Industry Challenges to Scale-up of Processing
  • Failure Mechanisms of Flexible Materials
  • Environmental Degradation of Electronics
  • Use-Case Scenario-Inspired Testing Strategies
  • Electronic Device Tolerances
  • Flexible Device Designs for Energy Harvesting, Storage, Transfer
  • Electronics on Ultra-thin Elastomers
  • Flexible Electronic Systems
  • Multi-layered Flexible Device Structures
  • Markets Challenges for Flexible Electronics

Invited Speakers:

  • Bill Babe (Liquid X Printed Metals, USA)
  • Jingyan Dong (North Carolina State University, USA)
  • Wei Gao (California Institute of Technology, USA)
  • Martin Kaltenbrunner (Johannes Kepler University Linz, Austria)
  • Jeff Meth (DuPont, USA)
  • Scott Miller (NextFlex, USA)
  • Qibing Pei (University of California, Los Angeles, USA)
  • Yolita Wildman (FLEX, USA)
  • Zijian Zheng (Hong Kong Polytechnic University, Hong Kong)

Symposium Organizers

Alon Gorodetsky
University of California, Irvine
Department of Chemical Engineering and Materials Science
USA

Jesse Jur
North Carolina State University
Textile Engineering, Chemistry & Science
USA
919-515-1676, jsjur@ncsu.edu

Jennifer Lewis
Harvard University
USA

Keywords for Abstract Submission

conductive ink, failure mechanisms, fatigue resistance, flexible conductors, manufacturing integration strategies, smart wearables, standardized methods